Storage Condition; Product Handling; Reflow Profile - Espressif Systems ESP32-PICO-V3-ZERO User Manual

6. Product Handling

6.
Product Handling

6.1 Storage Condition

The products sealed in Moisture Barrier Bag (MBB) should be stored in a noncondensing atmospheric environment
of < 40 °C/90%RH.
The module is rated at moisture sensitivity level (MSL) 3.
After unpacking, the module must be soldered within 168 hours with factory conditions 25±5 °C/60%RH. The
module needs to be baked if the above conditions are not met.
6.2 ESD
• Human body model (HBM): 2000 V
• Charged-device model (CDM): 500 V
• Air discharge: 6000 V
• Contact discharge: 4000 V

6.3 Reflow Profile

250
217
200
Ramp-up zone
1 ~ 3℃/s
100
50
25
0
0
Ramp-up zone — Temp.: <150℃ Time: 60 ~ 90s Ramp-up rate: 1 ~ 3℃/s
Preheating zone — Temp.: 150 ~ 200℃ Time: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8℃/s
Reflow zone — Temp.: >217℃
Cooling zone — Peak Temp. ~ 180℃ Ramp-down rate: -1 ~ -5℃/s
Solder — Sn&Ag&Cu Lead-free solder (SAC305)
Note:
Solder the module in a single reflow. If the PCBA requires multiple reflows, place the module on the PCB during the final
reflow.
Espressif Systems
Preheating zone
150 ~ 200℃ 60 ~ 120s
100
50
60 ~ 90s; Peak Temp.: 235 ~ 250℃ (<245℃ recommended) Time: 30 ~ 70s
Figure 6: Reflow Profile
Peak Temp.
235 ~ 250℃
Reflow zone
217℃ 60 ~ 90s
Soldering time
150 200
Cooling zone
-1 ~ -5℃/s
> 30s
Time (sec.)
250