u-blox M8 Series Hardware Integration Manual page 16

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 For the professional grade NEO-M8L, limit time above 217 °C liquidus temperature to 40 - 60 s.
For the NEO-M8L-01A (automotive grade), the time above 217 °C should be limited to 60-150
seconds.
 Peak reflow temperature for professional grade NEO-M8L is 245 °C, and for NEO-M8L-01A it is
250 °C.
Cooling phase
A controlled cooling avoids negative metallurgical effects of the solder (solder becomes more brittle)
and possible mechanical tensions in the products. Controlled cooling helps to achieve bright solder
fillets with a good shape and low contact angle.
 Temperature fall rate: max 4 °C/s for the NEO-M8L, max 6 °C/s for the NEO-M8L-01A
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To avoid falling off, the NEO-M8L module should be placed on the topside of the motherboard
during soldering.
The final soldering temperature chosen at the factory depends on additional external factors like
choice of soldering paste, size, thickness and properties of the base board, and so on. Exceeding the
maximum soldering temperature in the recommended soldering profile may permanently damage the
module.
Figure 11: Recommended soldering profile for the professional grade NEO-M8L
Figure 12: Recommended soldering profile for the automotive grade NEO-M8L-01A
UBX-16010549 - R08
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NEO-M8L - Hardware integration manual
Product handling Page 16 of 28