Sunx M Series Instruction Manual

INSTRUCTION MANUAL
Photoelectric Sensor
M Series
Thank you very much for using SUNX products. Please read this Instruc-
tion Manual carefully and thoroughly for the correct and optimum use of this
product. Kindly keep this manual in a convenient place for quick reference.
Never use this product as a sensing device for personnel protection.
In case of using sensing devices for personnel protection, use products
which meet laws and standards, such as OSHA, ANSI or IEC etc., for
personnel protection applicable in each region or country.
1

OUTLINE

This product detects wafers in a wafer
cassette simultaneously in the process
of manufacturing semiconductors.
Since the emitter and the receiver are
comb-like structure, number or position
of wafers can be checked.
As the I/O part is the connector type,
maintenance can be easily done.
2

MOUNTING

Attached spacers must be used to mount the sensor.
The tightening torque of the M4 screws should be 0.78 N·m or less.
Plain washer
Spring washer
M4 screw
Carefully mount the sensor so that
the sensing probes do not touch any
wafer.
Adjust the mounting of the sensor
so that when the wafers are inserted
into the spaces between the sensor
probes, the distance between the ori-
12mm or less.
3

CONNECTION METHOD

Recommended mating connector
Model No.
HIF3BA-30D-2.54R
Note: Since the recommended mating connector is not attached, please arrange
separately.
Wafer Address Sensor
WARNING
Wafer
Sensor body
Spacer (Accessory)
Mounting board
Good Not good
12mm or less
Recommended mating
connector
Manufacturer
Hirose Electric Co., LTD.
Recommended mating connector components
The recommended mating connector consists of the following three
components.
<Main body>
<Protector>
<Clamp>
Connection method
1. Prepare the exclusive jigs as follows, and a jig for cutting the cable.
Jig
Connection press
Pressing block
Guide plate
Wafer cassette
2. Cut the cable to the required length.
3. Fix the guide plate and the pressing block to the connection press.
Set the components to the guide plate in order of protector, cable, and
the main body, then press down by the connection press.
Connection press
Pressing block
Guide plate
Note : Match the orientation mark of the cable with the polarity mark.
4. Bend the cable and mount the clamp.
Wafer
4

I/O CIRCUIT DIAGRAM

5V
Wafer
5V
Orientation flat
Sensor body
Internal circuit
Notes: 1) Terminal No. 28 of
2) The sensing output does not incorporate a short-circuit protection circuit.
Do not connect it directly to a power supply or a capacitive load.
*1
Non-voltage contact or NPN open-collector transistor
• Test input (Emission halt input)
Low (+1.5V or less): Emission halt, High (+3.6V or more): Emission
• Output invalid input
Low (+1.5V or less): All channels OFF, High (+3.6V or more): Output possible
Assembly diagram
15.6mm
Product name
Hi-Flex connection press HHP 502
Pressing block A-01
HIF3-CPA2
Main body
Cable
Clamp
<Completion drawing>
Terminal No.
(2) + V
*1
(30) Test input
(Emission halt input)
(29) Output
invalid input
(3) Channel 1 sensing output
20mA max.
(28) Channel 26 sensing
20mA max. output (Note 1)
(1) 0V
Users' circuit
M-825 and M-625 is assigned 0V.
or
42.67mm
HRS No. Manufacturer
550-0082-2
Hirose Electric
550-0133-1
Co., LTD.
550-0156-7
Polarity mark
Orientation mark Protector
+
20 to 26.4V DC