electrostatic susceptibility;
Please ensure the humidity is within limited range, some parts are sensitive to humidity;
Please avoid using modules under too high or too low temperature.
8.3 BER(Bit Error Rate) is high
There are co-channel signal interference nearby, please be away from interference sources or modify
frequency and channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable;
The extension line and feeder quality are poor or too long, so the bit error rate is high.
9 Welding instruction
9.1 Reflow soldering temperature
Solder Paste
Preheat Temperature min (Tsmin)
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time(tL)Maintained Above(TL)
Peak temperature(Tp)
Aveage ramp-down rate(Tp to Tsmax)
Time 25℃ to peak temperature
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Profile Feature
Sn-Pb Assembly
Sn63/Pb37
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
6 minutes max
Pb-Free Assembly
Sn96.5/Ag3/Cu0.5
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6℃/second max
8 minutes max
30