SIM Tech SIMCom SIM900-DS Hardware Design page 16

Smart Machine Smart Decision
Figure 4: Recommended PCB footprint outline（Unit: mm）
Note: Keep copper out of area A. Do not place via in area B to avoid short circuit between the via on customer board and the test
points on the bottom side of the module.
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SIM900-DS_Hardware Design_V1.00 2013-01-20