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Tool Description
Screw driver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Extract all of the part 2.
2.
Unscrew the screws on part 3, and then remove part 3.
3.
Unscrew the screws on part 7, and then remove part 7.
4.
Remove part 3 and part 5 from chassis 1.
5.
Remove part 4 and part 6 from chassis 1.
6.
Remove part 8 and part 9 from chassis 1.
7.
Unscrew the screws on part 10, and then remove part 10.
8.
Unscrew the screws on pcb 11, and then remove pcb 11.
9.
Unscrew the screws on pcb 12, and then remove pcb 12.
10. Unscrew the screws on part 1-1, and then remove part 1-1.
11. Unscrew the screws on part 1-2, and then remove part 1-2.
12. Unscrew the screws on part 1-3, and then remove part 1-3.
13. Unscrew the screws on part 1-4, and then remove part 1-4.
14. Unscrew the screws on part 1-4-1, and then remove part 1-4-1.
15. Unscrew the screws on part 1-4-2, and then remove part 1-4-2.
16. Unscrew the screws on pcb 15, and then remove pcb 15.
17. Unscrew the screws on part 1-4-3, and then remove part 1-4-3.
18. Unscrew the screws on part 1-4-4, and then remove part 1-4-4.
19. Unscrew the screws on pcb 14, and then remove pcb 14.
20. Unscrew the screws on pcb 13, and then remove pcb 13.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
MF877-00
Template Revision A
Figure 1 Treatments to the product (rear view)
HPE instructions for this template are available at
Tool Size (if
applicable)
2#
MF877-01
Page 2
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