Sierra Wireless AirPrime MC7710 Product Technical Specification & Customer Design Manuallines page 70

Product Technical Specification & Customer Design Guidelines
Table B-1: Hardware integration design considerations (Continued)
Suggestion
Provide ESD protection for the SIM connector at the exposed
contact point (in particular, the CLK, VCC, IO, and RESET lines).
Keep very low capacitance traces on the USIM_DATA and
USIM_CLK signals.
To minimize noise leakage, establish a very good ground
connection between the module and host.
Route cables away from noise sources (for example, power
supplies, LCD assemblies, etc.).
Shield high RF-emitting components of the host device (for
example, main processor, parallel bus, etc.).
Use discrete filtering on low frequency lines to filter out unwanted
high-order harmonic energy.
Use multi-layer PCBs to form shielding layers around high-speed
clock traces.
Thermal
Test to worst case operating conditions — temperature, voltage,
and operation mode (transmitter on 100% duty cycle, maximum
power).
Use appropriate techniques to reduce module temperatures (for
example, airflow, heat sinks, heat-relief tape, module placement,
etc.).
Host / Modem communication
Make sure the host USB driver supports remote wakeup,
resume, and suspend operations, and serial port emulation.
When no valid data is being sent, do not send SOF tokens from
the host (causes unnecessary power consumption).
70 Proprietary and Confidential - Contents subject to change
Section where discussed
SIM implementation on
page 34
SIM implementation on
page 34
Ground connection on page 41
Methods to mitigate decreased
Rx performance on page 42
Methods to mitigate decreased
Rx performance on page 42
Methods to mitigate decreased
Rx performance on page 42
Methods to mitigate decreased
Rx performance on page 42
Thermal considerations on
page 60
Thermal considerations on
page 60
[5] AirCard / AirPrime USB
Driver Developer's Guide
(Doc# 2130634)
[5] AirCard / AirPrime USB
Driver Developer's Guide
(Doc# 2130634)
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