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Product Technical Specification & Customer Design Guidelines
60
Proprietary and Confidential - Contents subject to change
Thermal considerations
Embedded modules can generate significant amounts of heat that must be
dissipated in the host device for safety and performance reasons.
Baseband 1
Pin 1
Top
Figure 8-4: Shield locations
The amount of thermal dissipation required depends on:
•
Supply voltage — Maximum power dissipation for the module can be up to
3.1 W (or 3.5 W in HSPA+ mode) at voltage supply limits.
•
Usage — Typical power dissipation values depend on the location within the
host, amount of data transferred, etc.
Specific areas requiring heat dissipation are shown in
•
Transmitter — Top face of module near RF connectors. Likely to be the hottest
area.
•
Baseband 1 —Top face of module, below the transmitter.
•
Receiver — Bottom face of module, behind the transmitter.
•
Baseband 2 — Bottom face of module, behind Baseband 1.
To enhance heat dissipation:
•
Maximize airflow over / around the module.
•
Locate the module away from other hot components.
•
If possible, use the mounting holes to attach (ground) the device to the main
PCB ground or a metal chassis.
Note: Adequate dissipation of heat is necessary to ensure that the module functions
properly, and to comply with the thermal requirements in [10] PCI Express Mini Card
Electromechanical Specification Revision 1.2.
Caution:
Thermal putty is not recommended — incorrect application of the material could
require exessive pressure to be applied when seating the board, resulting in damage to the
board.
Transmitter
Receiver
Baseband 2
Pin 1
Bottom
Figure
8-4:
2400089
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