Samsung Sens NT-R410 Series Service Manual page 208

Design Location Level
R59 ........4
R245 ........4
R246 ........4
R54 ........4
R55 ........4
R56 ........4
R50 ........4
R164 ........4
R240 ........4
R241 ........4
R193 ........4
R236 ........4
R273 ........4
R276 ........4
R223 ........4
R218 ........4
R219 ........4
R202 ........4
R203 ........4
R611 ........4
R100 ........4
R101 ........4
R102 ........4
R103 ........4
R104 ........4
R119 ........4
R124 ........4
R125 ........4
R196 ........4
R564 ........4
R568 ........4
R185 ........4
R187 ........4
R183 ........4
R156 ........4
R179 ........4
R120 ........4
R140 ........4
R130 ........4
R131 ........4
PCB(HANNST) ........4
PCB(NANYA) ........4
SMT_LABEL ........4
BIOS_REV ........4
MICOM_REV ........4
PCB(GCE) ........4
SMT_ETC ........4
0.6 SMT ..........5
SOLDER CREAM ..........5
METAL MASK SOLVENT ..........5
ABLE BOND ..........5
PART ADHESIVE ..........5
SOLDER CREAM ..........5
Q19 ........4
CAMERA1 ........4
SPK1 ........4
TPAD1 ........4
MICOM ........4
C53 ........4
C47 ........4
U3 ........4
U2 ........4
Q1 ........4
M3 ........4
Q1 ........4
Parts Code Parts Description
2007-007239 R-CHIP
2007-000173 R-CHIP
2007-000173 R-CHIP
2007-000173 R-CHIP
2007-000173 R-CHIP
2007-000173 R-CHIP
2007-008133 R-CHIP
2007-000147 R-CHIP
2007-000147 R-CHIP
2007-000147 R-CHIP
2007-000939 R-CHIP
2007-000939 R-CHIP
2007-000939 R-CHIP
2007-000939 R-CHIP
2007-007156 R-CHIP
2007-000082 R-CHIP
2007-000082 R-CHIP
2007-000239 R-CHIP
2007-000239 R-CHIP
2007-000239 R-CHIP
2007-008026 R-CHIP
2007-008026 R-CHIP
2007-008026 R-CHIP
2007-008026 R-CHIP
2007-008026 R-CHIP
2007-008026 R-CHIP
2007-008026 R-CHIP
2007-008026 R-CHIP
2007-008026 R-CHIP
2007-008026 R-CHIP
2007-008026 R-CHIP
2007-007796 R-CHIP
2007-007796 R-CHIP
2007-000043 R-CHIP
2007-007992 R-CHIP
2007-007992 R-CHIP
2007-000146 R-CHIP
2007-000146 R-CHIP
2007-007548 R-CHIP
2007-007548 R-CHIP
BA41-00859A PCB MAIN
BA41-00861A PCB MAIN
BA68-10191W LABEL-BARCODE
BA68-40012N LABEL-LOCATION
BA68-40012N LABEL-LOCATION
BA41-00860A PCB MAIN
BA99-07565A ASSY SUB/MATERIAL-NP_SMT
0202-001499 SOLDER-WIRE FLUX
0202-001461 SOLDER-CREAM
0204-000199 SOLVENT
0201-001002 ADHESIVE-TS
0201-000160 ADHESIVE-TS
0202-001520 SOLDER-CREAM
0505-001585 FET-SILICON
3711-000922 HEADER-BOARD TO CABLE
3711-000922 HEADER-BOARD TO CABLE
3708-002402 CONNECTOR-FPC/FFC/PIC
BA46-07994A S/W MICOM
2203-001103 C-CER,CHIP
2203-000604 C-CER,CHIP
1205-003091 IC-ETHERNET CONTROLLER
1009-001010 IC-HALL EFFECT S/W
0505-001239 FET-SILICON
BA61-00932A SUPPORT-FIRMWARE
0505-001173 FET-SILICON
Spec.
31.6Kohm,1%,1/10W,TP,1608
22ohm,5%,1/16W,TP,1005
22ohm,5%,1/16W,TP,1005
22ohm,5%,1/16W,TP,1005
22ohm,5%,1/16W,TP,1005
22ohm,5%,1/16W,TP,1005
56.2Kohm,1%,1/10W,TP,1608
8.2Kohm,5%,1/16W,TP,1005
8.2Kohm,5%,1/16W,TP,1005
8.2Kohm,5%,1/16W,TP,1005
47Kohm,1%,1/10W,TP,1608
47Kohm,1%,1/10W,TP,1608
47Kohm,1%,1/10W,TP,1608
47Kohm,1%,1/10W,TP,1608
1ohm,5%,1/16W,TP,1005
3.3Kohm,5%,1/10W,TP,1608
3.3Kohm,5%,1/10W,TP,1608
1.5Kohm,1%,1/10W,TP,1608
1.5Kohm,1%,1/10W,TP,1608
1.5Kohm,1%,1/10W,TP,1608
56ohm,1%,1/16W,TP,1005
56ohm,1%,1/16W,TP,1005
56ohm,1%,1/16W,TP,1005
56ohm,1%,1/16W,TP,1005
56ohm,1%,1/16W,TP,1005
56ohm,1%,1/16W,TP,1005
56ohm,1%,1/16W,TP,1005
56ohm,1%,1/16W,TP,1005
56ohm,1%,1/16W,TP,1005
56ohm,1%,1/16W,TP,1005
56ohm,1%,1/16W,TP,1005
2.21Kohm,1%,1/10W,TP,1608
2.21Kohm,1%,1/10W,TP,1608
1Kohm,1%,1/10W,TP,1608
1ohm,1%,1/10W,TP,1608
1ohm,1%,1/10W,TP,1608
6.8Kohm,5%,1/16W,TP,1005
6.8Kohm,5%,1/16W,TP,1005
39.2ohm,1%,1/10W,TP,1608
39.2ohm,1%,1/10W,TP,1608
XIAN,OSP L/F,6L,1.0T,1.1 mm,W223.77*248.00 mm,-,1,-,-,-
XIAN,OSP L/F,6L,1.0T,1.1 mm,W223.77*248.00 mm,-,1,-,-,-
Note PC ALL,-,ARTPAPER,-,W6,L40mm,White,-,PCB-TOP/BOTTOM,Barcode-SMT
NOTE PC,-,ART PAPER,-,W6.2,L6.2MM,-,-,-,-
NOTE PC,-,ART PAPER,-,W6.2,L6.2MM,-,-,-,-
XIAN,OSP L/F,6L,1.0T,1.1 mm,W223.77*248.00 mm,-,1,-,-,-
N/P,SMT SUB/MATERIAL,RIBBON,SOLVENT,BOND,-
SR34 SUPER LFM-48,-,D0.6,96.5Sn/3Ag/0.5Cu,Flux_3.5%
NP303-LD155-GQ,-,D38~10UM,96.5SN/3AG/0.5CU,FLUX 10.5%
SUPANUKE-20,I.P.A,98%,-
8380,SIL,9000CPS,10cc
D520,NTR,-
LFM-48X TM-HP,-,D25-45um,96.5Sn/3Ag/0.5Cu,Flux 12.0%
FDC653N,N,30V,5A,55mohm,1.6W,SSOT-6
BOX,4P,1R,1.25mm,SMD-A,SN,WHT
BOX,4P,1R,1.25mm,SMD-A,SN,WHT
6P,1.0mm,SMD-A,SnBi,Y,SLIDE,BOTTOM
XIAN,-,SYSTEM,ALL,00SX,-,S/W MICOM
6.8nF,10%,50V,X7R,1608
22nF,10%,25V,X7R,1608
88E8055,QFN,64P,9x9mm,PLASTIC,3.63V,800mW,0to+70C,TR,PCI-E, Gigabit
Ethernet
A3212ELH/HED55XXU12,SC-59A,3P,82MIL,TP,PLASTIC,3.5V,2mA,-40to+85C,-,-
Si4804BDY,N,30V,5.7A,0.03ohm,1.1W,SO-8
VENICE,CU ALLOY,T1.5,W4.5,L2.4mm,-,SMT,Firm-ware board
PHKD13N03LT,N,30V,10.4A,0.02ohm,3.57W,SO-8
Quantity Service Alt.
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V A0-01-2-30
1 V A0-03-2-40
1 V
1 V
1 V
1 V A0-02-2-30
1 V
1 V
4 V ZZ-01-2-50
0.001 V
0.001 V
0.001 V
4 V ZZ-02-2-50
1 V A1-01-2-50
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V
1 V A7-02-2-50
1 V
1 V A7-01-2-50