Main Unit Inspection - HTC S710D Manual

6.3 Main unit inspection

Status of main unit assembly.
1.
2 Gap around power key, volume key, camera key
3 Gap between bezel and T/W.
4 Gap between bezel and battery cover.
1. Step between battery cover and bezel.
Step between T/W & bezel
2.
1. Virtual key bright/light/ black dot
2. Virtual key light leakage / overlap
Description
Class A
HTC CONFIDENTIAL
Description
Description
Virtual key inspection
Description
Exposure of substrate do not accept
Scratch : L 4mm ,W 0.2mm ,N 2, S 10mm
Gap inspection
Defective assembly and deformed shape were not
allowed.
Gap between power key, volume key ≦0.3 mm
Gap between bezel & T/W≦0.3 mm.
Gap between bezel and battery cover 0.3mm.
Step inspection
Step between battery cover and bezel 0.2mm
Step between T/W and bezel 0.2mm, T/W should
not higher than bezel
N = 1 , 0.1 mm , 1 point / 1 mode
less than 0.1mm : N= 4points or less / each mode
It's not acceptable.
Scratch
A c c e p t c r i t e r i a
≦ ≦
70
A c c e p t c r i t e r i a
A c c e p t c r i t e r i a
A c c e p t c r i t e r i a
N= 3points or less / each icon
D>1.5mm
≦ ≧
IS-5344-01-R3
MI