1. Introduction ......................................................................................................................... 错误!未定义书签。
Product Features ............................................................................................................ 错误!未定义书签。
1.1
Product overview ............................................................................................................ 错误!未定义书签。
1.2
Product Tips ................................................................................................................... 错误!未定义书签。
1.3
2.1
Tool list ...................................................................................................................................................... 15
2.2
Disassembling procedure .......................................................................................................................... 16
2.3
Assembling procedure ............................................................................................................................... 24
Repair or assembly tips .................................................................................................. 错误!未定义书签。
2.4
Unit label location explanation......................................................................................... 错误!未定义书签。
2.5
3. ROM Re-flash Procedure .................................................................................................... 错误!未定义书签。
Latest ROM version inquiry ............................................................................................. 错误!未定义书签。
3.1
ROM upgrade thru RUU (Re-flash Upgrade Utility) ......................................................... 错误!未定义书签。
3.2
Rom Image upgrade thru SD card................................................................................... 错误!未定义书签。
3.3
4. DIAGNOSTIC PROGRAM ............................................................................................................................... 41
Diagnostic mode testing.................................................................................................. 错误!未定义书签。
4.1
4.2
OS Mode Testing ....................................................................................................................................... 50
4.3
4.4
Hardware calibration .................................................................................................................................. 59
5. Power measurement test ............................................................................................................................... 62
5.1
5.2
6. Cosmetic Inspection Criteria ......................................................................................................................... 67
6.1
6.2
Display inspection ...................................................................................................................................... 69
6.3
Main unit inspection ................................................................................................................................... 70
7.1
SPL for Repair ........................................................................................................................................... 73
7.2
Board Level 2.5 Repairs ............................................................................................................................ 78
7.3
8. RF Antenna Specification .............................................................................................................................. 82
HTC CONFIDENTIAL
2
IS-5344-01-R3