Guide For Production; Top And Bottom View Of Sim5360; Typical Solder Reflow Profile - SIM Tech SIMCom SIM5360 Hardware Design

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Guide for Production

6.1

These test points are only used for module manufacturing and testing. They are not for customer's

application.

6.2

For customer convenience, SIMCom provides a typical example for a commonly used soldering profile. In

final board assembly, the typical solder reflow profile will be determined by the largest component on the

board, as well as the type of solder/flux used and PCB stack-up. Therefore the soldering profile shown

below is only a generic recommendation and should be adjusted to the specific application and

manufacturing constraints.

SIM5360_Hardware Design_V1.06

Figure 42: Top and bottom view of SIM5360

Smart Machine Smart Decision

2016-11-17

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