Telit Wireless Solutions LE51-868 S User Manual
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Telit Wireless Solutions LE51-868 S User Manual

Rf module
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LE51-868 S RF Module User
Guide
1VV0301131 Rev.0 – 2014-01-16

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Summary of Contents for Telit Wireless Solutions LE51-868 S

  • Page 1 LE51-868 S RF Module User Guide 1VV0301131 Rev.0 – 2014-01-16...
  • Page 2 LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 APPLICABILITY TABLE PRODUCT LE51-868 S Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 2 of 38...
  • Page 3 LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 SPECIFICATIONS SUBJECT TO CHANGE WITHOut Notice Notice While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein.
  • Page 4 LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 Usage and Disclosure Restrictions License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement.

  • Page 5: Table Of Contents

    Ordering Information ........19 Technical Description ........21 4.1. Module Top View (cover side) ......21 4.2. Pin-out of the module LE51-868 S ......22 4.3. Pin-out of the DIP Interface ......23 4.4. Pin-out correspondence table ......24 4.5.
  • Page 6 Soldering Profile (RoHS Process) ......28 Board Mounting Recommendation ....... 30 6.1. Electrical environment ........30 6.2. Power supply decoupling on LE51-868 S module ..... 30 6.3. RF layout considerations ......... 31 6.4. Antenna connections on printed circuit boards .... 32 6.5.

  • Page 7: Introduction

    LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 Introduction 1.1. Scope Scope of this document is to present the features and the application of the Telit LE51-868 S radio modules. 1.2. Audience This document is intended for developers using Telit LE51-868 S radio modules.

  • Page 8: Text Conventions

    LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 “Chapter 4: “Technical Description” describes in detail the signals and pin-out of the product. “Chapter 5: “Process information” describes in detail the delivery, storage, soldering and placement of the product. “Chapter 6: “Board Mounting Recommendations”...

  • Page 9: Related Documents

    LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 1.6. Related Documents • [1] EN 300 220-2 v2.4.1, ETSI Standards for SRD , May 2012 • [2] ERC Rec 70-03, ERC Recommendation for SRD, October 2012 • [3] 2002/95/EC, Directive of the European Parliament and of the Council, 27 January 2003 •...

  • Page 10: Requirements

    1VV0301131Rev.0 – 2014-01-16 Requirements 2.1. General Requirements The LE51-868 S module is a multi-channel radio board, delivering up to 35 mW in the 868 MHz ISM band (unlicensed frequency band). It is delivered with preloaded protocol stack: • LE51-868 S SIGFOX™ Network Software.

  • Page 11: Other Requirements

    2.4. Functional Requirements The LE51-868 S module is a complete solution from serial interface to RF interface. The LE51-868 module has a digital part and a RF part. The radio link on Sigfox network is a mono-directional link, since RX features are not required to be compliant with the network protocol.

  • Page 12: Software

    LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 • Packet handling 2.5. Software The LE51-868 S module is provided pre-flashed with one of the available Telit in-house Protocol Stack. Please refer to Protocol Stack User Guide [7] for detailed information. 2.6. Temperature Requirements Minimum...

  • Page 13: General Characteristics

    • LGA on the 4 external sides Number of pins : The metallic shield used on LE51-868 S covers all the SMD components Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 13 of 38...

  • Page 14: Mechanical Dimensions

    LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 3.2. Mechanical dimensions Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 14 of 38...

  • Page 15: Recommended Land Pattern

    LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 3.3. Recommended Land pattern 3.4. DC Characteristics Measured on DIP interface with T = 25°C, Vdd = 3V, 50 impedance and default power register setting if nothing else noted. Max limits apply over the entire operating range, T=-40°C to +85°C, Vdd=2V to 3.6V and all channels.

  • Page 16: Le51-868 S Functional Characteristics

    LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 3.5. LE51-868 S Functional Characteristics Measured on DIP interface with T = 25°C, Vdd = 3V, 50 impedance and default power register setting if nothing else noted. Frequency Band 868.178 MHz – 868.222 MHz...
  • Page 17 LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 Limits allowed by ETSI Standard are reported in the table below: Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 17 of 38...

  • Page 18: Digital Characteristic

    LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 3.6. Digital Characteristic Function Characteristics • 128 kB + 8 kB in system programmable flash • µC 8 kB RAM • 2 kB E PROM • RS232 TTL Full Duplex •...

  • Page 19: Ordering Information

    • The DIP interface version (LE51-868 S) • The Demo Case (LE51-868 S) composed by n.1 evaluation boards, n.1 DIP interface boards, RF antennas, serial cable, battery. The versions below are considered standard and should be readily available. For other versions, please contact Telit.
  • Page 20 LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 Equipment SMD Version LE51-868 S/SMD DIP Version B LE51-868 S Demo Case D LE51-868 S Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 20 of 38...

  • Page 21: Technical Description

    LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 Technical Description 4.1. Module Top View (cover side) CAUTION: reserved pins must not be connected CAUTION: In case you want to use in the same application Telit ZE51 or ZE61 modules J9 and J8 should not be connected, since reserved on these modules (see foot notes on Pin- Out tables.

  • Page 22: Pin-Out Of The Module Le51-868 S

    LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 4.2. Pin-out of the module LE51-868 S Pin name Pin type Signal level Function RF Ground connection for external antenna Ext_Antenna RF I/O connection to external antenna RF Ground connection for external antenna...

  • Page 23: Pin-Out Of The Dip Interface

    LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 4.3. Pin-out of the DIP Interface Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 23 of 38...

  • Page 24: Pin-Out Correspondence Table

    LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 4.4. Pin-out correspondence table Pin-Out correspondence between LE51-868 S/DIP and LE51-868 S/SMD. LE51-868 S/DIP LE51-868 S/SMD Comments Connector Name Pin Pin Name IO5_A IO9_I Reserved Pin STANDBY STATUS RADIO STATUS IO4_A...

  • Page 25: Description Of The Signals

    LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 4.5. Description of the signals Signals Description External hardware reset of the radio module. RESET Active on low state. Serial link signals, format NRZ/TTL: TXD, RXD TXD is for outgoing data. RXD is for incoming data.

  • Page 26: Process Information

    5.1. Delivery LE51-868 S modules are delivered in plastic tray packaging, each tray including 50 units. The dimensions of the tray are the following: 329 mm x 176 mm x 5.6 mm. Each unit is placed in a 26.6 mm x 16 mm location. An empty tray weights 45 g and a loaded tray weights around 130 g.

  • Page 27: Storage

    Soldering pad pattern The surface finished on the printed circuit board pads should be made of Nickel/Gold surface. The recommended soldering pad layout on the host board for the LE51-868 S is shown in the diagram below: All dimensions in mm Neither via-holes nor wires are allowed on the PCB upper layer in area occupied by the module.

  • Page 28: Placement

    5.6. Soldering Profile (RoHS Process) It must be noted that LE51-868 S module should not be allowed to be hanging upside down during the reflow operation. This means that the module has to be assembled on the side of the printed circuit board that is soldered last.
  • Page 29 CAUTION - It must also be noted that if the host board is submitted to a wave soldering after the reflow operation, a solder mask must be used in order to protect the LE51-868 S radio module’s metal shield from being in contact with the solder wave.

  • Page 30: Board Mounting Recommendation

    6.2. Power supply decoupling on LE51-868 S module The power supply of LE51-868 S module must be nearby decoupled. A LC filter must be placed as close as possible to the radio module power supply pin, VDD. Power Supply Symbols...

  • Page 31: Rf Layout Considerations

    LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 6.3. RF layout considerations Basic recommendations must be followed to achieve a good RF layout: • It is recommended to fill all unused PCB area around the module with ground plane •...

  • Page 32: Antenna Connections On Printed Circuit Boards

    LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 6.4. Antenna connections on printed circuit boards Special care must be taken when connecting an antenna or a connector to the module. The RF output impedance is 50 , so the strip between the pad and the antenna or connector must be following the tables below.

  • Page 33: Le51-868 S Interfacing

    LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 6.5. LE51-868 S Interfacing Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 33 of 38...
  • Page 34 LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 34 of 38...
  • Page 35 LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 35 of 38...

  • Page 36: Safety Recommendations

    LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 Safety Recommendations READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas: •...

  • Page 37: Glossary

    LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 Glossary Adjacent Channel Power Adaptive Frequency Agility Bits per second BPSK Binary Phase Shift Keying Bandwidth Decibel Power level in decibel milliwatt (10 log (P/1mW)) PROM Electrically Erasable Programmable Read Only Memory Effective radiated power e.r.p...

  • Page 38: Document History

    LE51-868 S RF Module User Guide 1VV0301131Rev.0 – 2014-01-16 Document History Revision Date Changes 2014/01/16 First release Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 38 of 38...

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