Preparing For Non-Raised-Floor Installation And Cabling; Raised Floor Requirements - IBM XIV Gen3 Series Planning Manual

600 mm (24.9 in)
(minimum 40% perforations)
Figure 8. Raised floor requirements
3. Cut a 200 mm × 200 mm (8 in. × 8 in.) opening in the rear floor tile for
under-floor cabling and electricity (see Figure 8).
Note: Place the opening under the XIV system, centered on the back edge of
the tile along the rear of the rack.
Sizing the cutout correctly is important. An oversized cutout permits excessive
cooling loss and weakens the floor tile. An undersized cutout must be enlarged,
which causes an installation delay while the tile is replaced or the cutout is
enlarged.
4. To allow for ventilation for airflow and support system cooling requirements,
have at least two tiles (and preferably more) in front of the XIV system (see
Figure 8). These tiles must have a minimum of 40% perforation.
5. If the ruggedized rack is ordered, see "Ruggedized rack feature" on page 21 for
additional floor preparation steps.
6. If the rear-door heat exchanger is ordered, see "Raised floor hose requirements
and management" on page 84 for additional floor preparation steps.

Preparing for non-raised-floor installation and cabling

Prepare the installation site to accommodate overhead cabling for mainline-power
cables, customer Fibre Channel host cables, network Ethernet cable, and customer
analog phone line.
Using overhead cabling provides many of the cooling and safety benefits that are
provided by raised flooring in a non-raised floor environment. Unlike raised-floor
cabling, the installation planning, cable length, and the system location in relation
to the cable entry point are critical to the successful installation of a top cable exit.
Notes:
v Main-power cables are routed to the rack by the customer, and internally routed
and connected by an IBM service representative.
v Host-attachment cables are internally routed and connected by either the
customer or by an IBM service representative.
v All remaining cables are internally routed and connected by an IBM service
representative.
If the ruggedized rack is ordered, see "Ruggedized rack feature" on page 21 for
more floor preparation steps.
If the rear-door heat exchanger is ordered, see "Non-raised floor hose requirements
and management" on page 87 for more floor preparation steps.
600 mm (24.9 in)
Ventilation tiles
Front
1142 mm (45.0 in)
Tile opening for cables
200 mm (8.0 in)
200 mm (8.0 in)
200 mm (8.0 in)
System footprint
Chapter 6. Installation site requirements
33