Figure 93. Removing the system processor module tool
13. Repeat step 10 on page 87 through 12 on page 90 for the remaining processor.
14. Inspect the thermal interface material (TIM) for visible signs of damage, as shown in Figure 94 on
page 93.
Note: When the heat sink is removed from the failed system processor module, the TIM should be
adhered to the heat sink. Unless damaged, the TIM that is adhered to the heat sink can be reused.
Replacing the TIM is optional and is only performed if the TIM is damaged. Do not reuse the
removed heat sink if the TIM is damaged. Either discard the heat sink and the damaged TIM locally
or return them to IBM based on part-order-form part status. It is recommended that a spare TIM and
heat sink, part number 00E8868, be on hand when replacing the system processor module.
92
System backplane
A