Opt3001 Pinout - Texas Instruments BOOSTXL-SENSORS BoosterPack User Manual

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The Sensors BoosterPack plug-in module adheres to the 40-pin LaunchPad development kit and
BoosterPack plug-in module pinout standard. A standard was created to aid compatibility between
LaunchPad development kits and BoosterPack plug-in modules across the TI ecosystem.
The 40-pin standard on the
other LaunchPad development kits like the
40-pin BoosterPack plug-in modules to be used with 20-pin LaunchPad development kits.
The BOOSTXL-SENSORS
stacking on top. You must take careful consideration when stacking other BoosterPack plug-in modules
near the Sensors BoosterPack plug-in module as heat, shade, and electromagnetic fields can adversely
affect the sensors readings.
More information about compatibility can also be found at www.ti.com/launchpad.
2.1.2 TI OPT3001 Light Sensor
The OPT3001 is a digital ambient light sensor (ALS) that measures the intensity of light as visible by the
human eye. Covering the sensor with a finger or shining a flashlight on it changes the output of the
OPT3001. The digital output is reported over an I
2-wire serial interface. The reference designator for the OPT3001 is U1.
of the OPT3001.
More information on the OPT3001 light sensor can be found at www.ti.com/product/opt3001.
2.1.3 TI TMP007 Temperature Sensor
The TMP007 is a digital infrared (IR) thermopile contactless temperature sensor with integrated math
engine that measures the temperature of an object without having to be in direct contact. Placing your
hand over the sensor increases the sensor output. The digital output is reported over an I
compatible, 2-wire serial interface. The reference designator for the TMP007 is U5.
connections of the TMP007.
NOTE: The TMP007 infrared temperature sensor is no longer populated on this BoosterPack board,
and only the PCB footprint is provided due to the end-of-life status of the device.
SLAU666B – June 2016 – Revised May 2018
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BOOSTXL-SENSORS
MSP-EXP430G2
BoosterPack plug-in module has both male and female headers to support
Table 1. OPT3001 Pinout
BoosterPack Header Connection
(1)
J1.9
(1)
J1.10
J2.11
(1)
Pin is multiplexed with the I
BMI160, and BME280.
Table 2. TMP007 Pinout
BoosterPack Header Connection
(1)
J1.9
(1)
J1.10
J2.12
(1)
Pin is multiplexed with the I
BMI160, and BME280.
Copyright © 2016–2018, Texas Instruments Incorporated
is compatible with the 20-pin standard that is used by
LaunchPad development kit. This allows for
2
C- and System Management Bus (SMBus)-compatible,
Pin Function
2
I C SCL
2
I C SDA
OPT3001 Interrupt
2
C communication lines of the TMP007,
Pin Function
2
I C SCL
2
I C SDA
TMP007 Interrupt
2
C communication lines of the OPT3001,
BOOSTXL-SENSORS Sensors BoosterPack Plug-in Module
Table 1 lists the pin connections
2
C- and SMBus-
Table 2 lists the pin
Hardware
5