Component Removal - Pace TP-65 Operation & Maintenance Instructions Manual

COMPONENT REMOVAL

Use the following procedure to remove the component. Ensure that the
component and board have been properly prepared (see "Board/Component
Preparation") before removing component. The technique shown is the
Bridgefill Method.
PROCEDURE
1. Ensure that all Board/
Component Preparation has
been performed.
2. Start with a tip temperature of
315°C (600°F) and adjust as
necessary.
3. Enter Tip Offset Constant for the
selected tip.
4. Install QFP Removal Tip into
ThermoPik using Tip Tool.
5. Install vacuum cup onto vacuum
pick tube using Tip Tool.
6. Remove old solder from tip with
sponge. Tin inside and bottom
edges of tip with solder.
7. Lower tip over component
contacting ALL leads with tip
(see &
8. Confirm solder melt of ALL
joints, apply vacuum and lift
component from PCB (see
& ).
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