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TIP PREPARATION
The TP-65 tips must be kept properly tinned and free of oxidation to ensure
that optimum heat transfer will take place at all times. Tips must be kept
properly tinned and free of oxidation to ensure that optimum heat transfer will
take place.
Tin the tip using the following procedure.
1. Clean all bottom edges of the installed
tip using the PACE fiber cleaning tool.
2. Shock the bottom edges of the installed
tip using a moist PACE sponge tool.
3. Apply a continuous bead of solder along
the bottom edges of the installed tip.
TIP TEMPERATURE
PACE recommends the use of a 316°C (600°F) tip temperature setting for
initial use in most applications. A low temperature extends tip life. You
should determine the lowest removal temperature to work with on your board
and component types.
Refer to the Tip & Temperature Selection System Chart (P/N 5050-0251
booklet) for your particular handpiece/tip combination. For all Dial/Display
systems, the booklet will indicate the correct Dial/Display setting for the True
Tip Temperature desired. On systems incorporating a Digital Readout, set the
desired operating temperature and Tip Offset Constant for the TP-65
handpiece/tip combination.
PCB/COMPONENT PREPARATION
Proper preparation is the key to successful component removal. Use the
following procedure to obtain optimum results.
PCB Preparation
1. Clean the component leads and PCB land areas using an approved
solvent or cleaner.
2. Ensure that the PCB is free of moisture.
3. Preheat the PCB as necessary. PCBs consisting of heat sinking
materials (e.g., ceramic, polyamide, etc.) or those with an
exceptionally heavy ground or power planes may require the use of a
preheater such as the PACE Heat Wave.
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