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Component Preparation
1. Remove any protective coatings and clean the component leads
and land areas using an approved solvent or cleaner.
2. Ensure that the PCB is free of moisture.
3. Preheat the PCB as necessary. PCBs consisting of heat sinking
materials (e.g., ceramic, polyamide, etc.) or those with an
exceptionally heavy ground or power planes may require the use of
a preheating system such as the PACE Heat Wave.
4. In order to maximize heat transfer from the handpiece tip to PQFP
component lead/land connections, PACE recommends adding
to maximize heat transfer across
all connections.
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bridgefill ..............
solder wrap ..........
or
flux ......................
11
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