Smt Process Parameters; Solder Reflow Profile; Figure 14. Pick & Place Area; Figure 15. Recommended Reflow Profile - Sierra Wireless AirPrime HL Series Customer Process Manuallines

Customer Process Guidelines
5.2.

SMT Process Parameters

The Pick & Place area to be used for the SMT process is 3.7 mm in diameter, centered on the heat-
sink.
Speed: Slowest speed for the machine.
Figure 14. Pick & Place Area
5.3.

Solder Reflow Profile

Lead-free SMT reflow profiles should be used to surface mount the AirPrime Snap-in socket.
The reflow profile depends on PCB density and type of solder paste being used. The paste
manufacturer's recommendation should also be considered to determine the proper reflow profile.
Peak Temperature
Due to its weigh, it is preferable to solder the Snap-in Socket on the last side.
The figure below is a reflow profile example.
Figure 15. Recommended Reflow Profile
4115102
245°C max
Rev 6.0
Board Mounting Guidelines
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