Summary of Contents for Sierra Wireless AirPrime HL Series
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Customer Process Guidelines AirPrime HL Series Snap-in Socket 4115102 February 21, 2014...
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Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property.
2. Snap-in Socket Characteristics 2.1. Storage Temperature Range Storage conditions are the range of ambient temperature where the connector housing can be stored without load. Storage temperature is -40°C to 85°C Relative humidity is 15% RH to 70% RH 2.2. Operating Temperature Range The range of ambient temperature for the connector housing which can be operated continuously at rated voltage and rated current is –40°C to 85°C.
Customer Process Guidelines Snap-in Socket Characteristics 2.5. Mechanical Characteristics Items Conditions Specifications No defects such as cracks, scratches Appearance or blemishes. Terminal retention The retention force when the terminal is extracted 0.7N or more force from connector housing shall be measured. 4115102 Rev 1.1 February 21, 2014...
Number of contacts: 66 Pins Weight: Snap-in socket with cover 2.5 mm: 4.7 g (TBC) Note: The AirPrime Snap-in socket if for use with the AirPrime HL Series modules. For additional information, refer to the product technical specifications listed in section 1.2 Reference Documents.
Customer Process Guidelines Handling 3.3. Component Packing 3.3.1. Packing Description The AirPrime Snap-in socket is packed in box. Box dimensions are 400x400x200mm (TBC). The quantity per each outer box is 450 AirPrime Snap-in frames and 450 covers. The inner packaging is different for the frame and for the cover as shown in the figures below. The frame of the Snap-in socket is delivered in tape and reel: Figure 4.
Snap-in socket on the application. Note: The AirPrime Snap-in socket should be assembled by reflow process. 4.1. Lead-Free Process In compliance with directive 2011/65/CE, Sierra Wireless products do not contain the following hazardous substances: mercury (Hg), lead (Pb), ...
Customer Process Guidelines SMT Assembly Process 4.2.2. Footprint The following figure shows the position of the copper pads. AirPrime Snap-in Socket Footprint Recommendation – Copper Layout Position Figure 6. In order to produce high assembly yields and a reliable solder joint, the footprint design should match Figure 7 below.
Note: The 64 inner pads and the 8 corner pads are ground pads. Sierra Wireless suggests that customers place a copper pad under the pin #1 mark to avoid any risks of short circuits between pin#1 and the customer layout.
Customer Process Guidelines SMT Assembly Process Warning: It is recommended to have a GROUND area under the Snap-in socket. This ground area should be a whole area of copper with proper ground vias to provide a good grounding system between the application and the embedded module and improved thermal dissipation.
Customer Process Guidelines SMT Assembly Process AirPrime Snap-in Socket Footprint Recommendation – Solder Mask Layout Figure 8. Recommended solder mask thickness on the top copper is 10 to 30 µm. 4115102 Rev 1.1 February 21, 2014...
5. Board Mounting Guidelines 5.1. Stencil Design The recommended stencil thickness is 125 µm. The proposed stencil design is presented in Figure 9 below. This stencil is compatible for both soldering the module on its own and for soldering a Snap-in Socket. It is highly recommended to monitor the solder paste height, registration and proper placement during the squeegee printing.
Customer Process Guidelines Board Mounting Guidelines 5.2. SMT Process Parameters The Pick & Place area to be used for the SMT process is 3.7 mm diameter, centered on the heat-sink. Speed: Slowest speed for the machine. Figure 10. Pick & Place Area 5.3.
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Customer Process Guidelines Board Mounting Guidelines Additional recommendations are presented in the table below for consideration. Factor Recommendation Max slope 2 to 4 °C / sec Soak time (between A and B: 150 and 190 °C) 60 to 120 sec Reflow time (D: over 220°C) 40 to 60 sec 235 –...
6. Insertion and Removal Guidelines 6.1. Insertion Guideline 1. Check the alignment of Pin 1 on both the module and the Snap-in socket. Pin 1 location on the module (black dot) Pin 1 location on the Snap-in socket (triangle) 2. Put the module down in the socket. Use vertical motion to insert the module. 3.
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Customer Process Guidelines Insertion and Removal Guidelines 4. Smoothly press the cover on to the Snap-in socket. The cover should be properly aligned with Pin 1 of the module. 5. Check that the cover holes are locked on the socket bumps on all sides. Cover holes 4115102 Rev 1.1...
Customer Process Guidelines Insertion and Removal Guidelines 6.2. Removal Guidelines Use the specific Snap-in removal tool to dismount the cover (P/N: 306CLE-001-00E). Figure 12. AirPrime Snap-in Socket Removal Tool To dismount the cover from the Snap-in socket, insert the Snap-in removal tool in the socket cavity, and then smoothly push the tool to pull up the cover and disengage the cover holes from the socket bumps.
Customer Process Guidelines Insertion and Removal Guidelines 6.3. AirPrime Snap-in Socket Damage Prevention Contact damage can be caused by incorrect operation. Refer to the following sub-sections for more information on what causes contact damage and how to prevent it. 6.3.1. Socket ...
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