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Summary of Contents for Sierra Wireless AirPrime HL Series
- Page 1 Customer Process Guidelines AirPrime HL and WP Series Snap-in Socket 4115102 June 15, 2017...
- Page 2 Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property.
- Page 3 This product may contain technology developed by or for Sierra Wireless Inc. This product includes technology licensed from QUALCOMM ® This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents licensed from InterDigital Group and MMP Portfolio Licensing. Copyright ©...
- Page 4 Customer Process Guidelines Document History Version Date Updates February 19, 2014 Creation Updated: February 21, 2014 Figure 17 AirPrime Snap-in Socket Removal Tool Figure 18 Snap-in Socket Removal Tool Added: 2.6 Part Numbering Information 6.1 Visual Inspection December 03, 2014 Updated: ...
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Page 5: Table Of Contents
Contents 1. INTRODUCTION ....................7 1.1. Overview ..........................7 1.2. Reference Documents ....................... 7 2. SNAP-IN SOCKET CHARACTERISTICS ............9 2.1. Storage Temperature Range ..................... 9 2.2. Operating Temperature Range ..................9 2.3. Standard Atmospheric Condition ..................9 2.4. Electrical Characteristics ....................9 2.5. - Page 6 List of Figures Figure 1. AirPrime Snap-in Socket ....................11 Figure 2. Sectional View of the 2.5 mm thick module Socket ............12 Figure 3. Sectional view of the 4.4 mm thick module Socket ............12 Figure 4. AirPrime Snap-in Socket Frame Delivered in Tape and Reel ......... 13 Figure 5.
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Page 7: Introduction
1. Introduction 1.1. Overview The AirPrime Snap-in socket is available for all variants of AirPrime modules compatible with the new COMMON FLEXIBLE FORM FACTOR (CF3 ). It has been specified and tested to preserve the high level of performance and reliability of the AirPrime module used inside. As a result, the AirPrime Snap-in socket can be used for test purposes, to ease development, as well as for volume production. - Page 8 Customer Process Guidelines Introduction [13] AirPrime HL7650 Product Technical Specification Reference number: 41110363 [14] AirPrime HL7688 Product Technical Specification Reference number: 4119272 [15] AirPrime HL7690 Product Technical Specification Reference number: 4118552 [16] AirPrime HL7692 Product Technical Specification Reference number: 4119631 [17] AirPrime HL8518, HL8528 and HL8529 Product Technical Specification Reference number: 4117047 [18] AirPrime HL8548 and HL8548-G Product Technical Specification...
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Page 9: Snap-In Socket Characteristics
2. Snap-in Socket Characteristics The Snap-in Socket is dedicated for use with any 22x23 mm HL or WP Series module from Sierra Wireless. Two variants of the Snap-in socket frame exists; one to support the HL series (66 signals on one ring) and the other to support the WP series (157 signals on 2 rings). -
Page 10: Mechanical Characteristics
Customer Process Guidelines Snap-in Socket Characteristics Items Conditions Specifications 100V AC shall be applied for 1 minute, then Between conductors without damages Withstand voltage measurement shall be made. such as arcs or breakdowns, etc. 2.5. Mechanical Characteristics Items Conditions Specifications No defects such as cracks, Appearance scratches or blemishes. -
Page 11: Handling
3. Handling 3.1. Storage of the AirPrime Snap-in Socket AirPrime Snap-in socket can be stored in their original packages, for up to 1 year. Tip: For optimal results, the recommended storage temperature is +20°C ± 10 degrees. 3.2. Component Package The Snap-in Socket is a scalable QFP, 27.4x28.4 mm, pitch 0.8 mm. -
Page 12: Figure 2. Sectional View Of The 2.5 Mm Thick Module Socket
Customer Process Guidelines Handling Figure 2. Sectional View of the 2.5 mm thick module Socket Figure 3. Sectional view of the 4.4 mm thick module Socket 4115102 Rev 6.0 June 15, 2017... -
Page 13: Component Packing
Customer Process Guidelines Handling 3.3. Component Packing The frame of the Snap-in Socket is delivered in tape and reel. There are 350 frames per tape and reel. Figure 4. AirPrime Snap-in Socket Frame Delivered in Tape and Reel The cover of the Snap-in Socket is delivered in tray. The tray size is 380x380mm. There are 350 covers per tray. -
Page 14: Smt Assembly Process
Snap-in Socket. Moreover, JTAG pins are also not present on the Snap-in Socket. Sierra Wireless suggests that customers place a copper pad under the Polarity mark to avoid any risk of short circuits between this pin and the customer layout; however, there is no need to solder it. -
Page 15: Figure 6. Recommended Hl Series Snap-In Socket Footprint - Copper Layout Position
Customer Process Guidelines SMT Assembly Process 4.2.2.1. HL Snap-in Socket The following figure shows the position of the copper pads. Figure 6. Recommended HL Series Snap-in Socket Footprint – Copper Layout Position 4115102 Rev 6.0 June 15, 2017... -
Page 16: Figure 7. Recommended Hl Series Snap-In Socket Footprint - Copper Layout
Customer Process Guidelines SMT Assembly Process Figure 7. Recommended HL Series Snap-in Socket Footprint – Copper Layout 4115102 Rev 6.0 June 15, 2017... -
Page 17: Figure 8. Recommended Wp Series Snap-In Socket Footprint - Copper Layout Position
Customer Process Guidelines SMT Assembly Process 4.2.2.2. WP Snap-in Socket The following figure shows the position of the copper pads. Figure 8. Recommended WP Series Snap-in Socket Footprint – Copper Layout Position 4115102 Rev 6.0 June 15, 2017... -
Page 18: Figure 9. Recommended Wp Series Snap-In Socket Footprint - Copper Layout
Customer Process Guidelines SMT Assembly Process Figure 9. Recommended WP Series Snap-in Socket Footprint – Copper Layout 4115102 Rev 6.0 June 15, 2017... -
Page 19: Layout Recommendations
SMT Assembly Process 4.2.3. Layout Recommendations Sierra Wireless’ layout recommendations include: A ground area under the AirPrime Snap-in Socket. This ground area should be a whole area of copper with proper ground vias to provide a good grounding system between the application and the embedded module, and improved thermal dissipation. -
Page 20: Figure 10. Recommended Hl Series Snap-In Socket Footprint - Solder Mask Layout
Customer Process Guidelines SMT Assembly Process Figure 10. Recommended HL Series Snap-in Socket Footprint – Solder Mask Layout 4115102 Rev 6.0 June 15, 2017... -
Page 21: Figure 11. Recommended Wp Series Snap-In Socket Footprint - Solder Mask Layout
Customer Process Guidelines SMT Assembly Process Figure 11. Recommended WP Series Snap-in Socket Footprint – Solder Mask Layout 4115102 Rev 6.0 June 15, 2017... -
Page 22: Board Mounting Guidelines
5. Board Mounting Guidelines 5.1. Stencil Design The recommended stencil thickness is 125 µm. The proposed stencil design is presented in Figure 12 and Figure 13 below. It is recommended to have a different stencil when mounting the Snap-in Socket and when soldering the module on its own. It is highly recommended to monitor the solder paste height, registration and proper placement during the squeegee printing. -
Page 23: Figure 12. Recommended Hl Series Snap-In Socket Footprint - Paste Mask Layout
Customer Process Guidelines Board Mounting Guidelines Figure 12. Recommended HL Series Snap-in Socket Footprint – Paste Mask Layout 4115102 Rev 6.0 June 15, 2017... -
Page 24: Figure 13. Recommended Wp Series Snap-In Socket Footprint - Paste Mask Layout
Customer Process Guidelines Board Mounting Guidelines Figure 13. Recommended WP Series Snap-in Socket Footprint – Paste Mask Layout 4115102 Rev 6.0 June 15, 2017... -
Page 25: Smt Process Parameters
Customer Process Guidelines Board Mounting Guidelines 5.2. SMT Process Parameters The Pick & Place area to be used for the SMT process is 3.7 mm in diameter, centered on the heat- sink. Speed: Slowest speed for the machine. Figure 14. Pick &... - Page 26 Customer Process Guidelines Board Mounting Guidelines Additional recommendations are presented in the table below for consideration. Factor Recommendation Max slope 2 to 4 °C / sec Soak time (between A and B: 150 and 190 °C) 60 to 120 sec Reflow time (D: over 220°C) 40 to 60 sec Max temperature (C)
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Page 27: Insertion And Removal Guidelines
6. Insertion and Removal Guidelines 6.1. Visual Inspection Prior to inserting the module, the operator should inspect the module and ensure that pins are not deformed. One typical failure is bent contacts; to avoid this, refer to section 6.4 for information regarding proper handling of the Snap-in Socket. - Page 28 Customer Process Guidelines Insertion and Removal Guidelines 2. Put the module down in the socket. Use vertical motion to insert the module. 3. Check the orientation of the cover based on the location of the Polarity mark. Polarity mark on the module should align with this Polarity mark on the module (black dot) 4.
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Page 29: Removal Guidelines
Customer Process Guidelines Insertion and Removal Guidelines 5. Check that the cover holes are locked on the socket bumps on all sides. Cover holes 6.3. Removal Guidelines Use the specific Snap-in removal tool to dismount the cover. Figure 17. AirPrime Snap-in Socket Removal Tool To dismount the cover from the Snap-in socket, insert the Snap-in removal tool in the socket cavity, and then smoothly push the tool to pull up the cover and disengage the cover holes from the socket bumps. -
Page 30: Airprime Snap-In Socket Damage Prevention
Customer Process Guidelines Insertion and Removal Guidelines 6.4. AirPrime Snap-in Socket Damage Prevention Contact damage can be caused by incorrect operation. Refer to the following sub-sections for more information on what causes contact damage and how to prevent it. 6.4.1. Socket ...
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