Board Mounting Guidelines; Stencil Design - Sierra Wireless AirPrime HL Series Customer Process Manuallines

5. Board Mounting Guidelines

5.1.

Stencil Design

The recommended stencil thickness is 125 µm.
The proposed stencil design is presented in Figure 12 and Figure 13 below. It is recommended to
have a different stencil when mounting the Snap-in Socket and when soldering the module on its own.
It is highly recommended to monitor the solder paste height, registration and proper placement during
the squeegee printing.
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