Table of Contents
Advertisement
Solder Reflow Temperature Profile
(Gull Wing Surface Mount Option 300 Parts)
260
240
220
∆T = 115°C, 0.3°C/SEC
200
180
160
140
120
100
80
∆T = 100°C, 1.5°C/SEC
60
40
20
0
0
1
2
3
Note: Use of nonchlorine activated fluxes is highly recommended.
Regulatory Information
The HCPL-24XX has been
approved by the following
organizations:
VDE
Approved according to VDE
0884/06.92 (Option 060 only).
Insulation and Safety Related Specifications
Parameter
Symbol
Minimum External
L(101)
Air Gap (External
Clearance)
Minimum External
L(102)
Tracking (External
Creepage)
Minimum Internal
Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative
Tracking Index)
Isolation Group
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
∆T = 145°C, 1°C/SEC
4
5
6
7
8
9
TIME – MINUTES
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
Value
Units
7.1
mm
7.4
mm
0.08
mm
CTI
200
Volts
IIIa
10
11
12
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Through insulation distance, conductor to
conductor, usually the direct distance between the
photoemitter and photodetector inside the
optocoupler cavity.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
1-303
Advertisement
Table of Contents
