Linear Technology LT3956 Series Manual page 19

package DescripTion
5.50 0.05
PIN 1
TOP MARK
(NOTE 6)
6.00 0.10
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
Variation: UHE28MA
36-Lead Plastic QFN (5mm 6mm)
(Reference LTC DWG # 05-08-1836 Rev C)
28 27
30
31
3.00 0.05
32
4.10 0.05
33
34
1.50 REF
35
36
1 2
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
5.00 0.10
0.200 REF
0.00 – 0.05
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
UHE Package
25 24 23 21 20
1.88 1.53
0.05 0.05
3.00 0.05
0.12
0.05
0.48 0.05
3 4 6 8 9 10
0.25 0.05
2.00 REF
5.10 0.05
6.50 0.05
0.75 0.05
R = 0.10
TYP
28
27
2.00 REF
25
24
23
21
20
BOTTOM VIEW—EXPOSED PAD
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
LT3956
0.70 0.05
17
16
15
14
PACKAGE OUTLINE
13
12
1.50 REF
30 31 32 33 34 35 36
1.88 0.10
3.00 0.10
0.12
0.10
0.48 0.10
1.53 0.10
3.00 0.10
17 16 15 14 13 12
0.25 0.05
0.50 BSC
PIN 1 NOTCH
R = 0.30 OR
0.35 45
CHAMFER
1
2
3
4
6
8
R = 0.125
TYP
9
10
0.40 0.10
(UHE28MA) QFN 0110 REV C
3956f