Package Description - Linear Technology LT4363 Datasheet

package DescripTion

Please refer to http://www.linear.com/designtools/packaging/
3.60 ±0.05
2.20 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695 Rev D)
3.30 ±0.05
1.70 ± 0.05
0.25 ± 0.05
0.50 BSC
2.50 REF
4.00 ±0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
For more information
for the most recent package drawings.
DE/UE Package
0.70 ±0.05
PACKAGE OUTLINE
R = 0.115
7
R = 0.05
TYP
3.00 ±0.10
(2 SIDES) 1.70 ± 0.10
6
0.25 ± 0.05
0.75 ±0.05
BOTTOM VIEW—EXPOSED PAD
0.00 – 0.05
www.linear.com/LT4363
0.40 ± 0.10
TYP
12
3.30 ±0.10
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
1
(UE12/DE12) DFN 0806 REV D
0.50 BSC
2.50 REF
LT4363
4363fb
21