Production Guidance - Ebyte E01-2G4M13S User Manual

Chengdu Ebyte Electronic Technology Co., Ltd.
The communication distance will be affected when obstacle exists.
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Data lose rate will be affected by temperature, humidity and co-channel interference.
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The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.
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Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
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The signal will be affected when the antenna is near metal object or put in a metal case.
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Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the distance).
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The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the
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transmitting power.
Due to antenna quality or poor matching between antenna and module.
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6.2 Module is easy to damage
Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module.
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Please check the stability of power source, the voltage cannot fluctuate too much.
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Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic

susceptibility.
 Please ensure the humidity is within limited range, some parts are sensitive to humidity.
 Please avoid using modules under too high or too low temperature.
6.3 BER(Bit Error Rate) is high
There are co-channel signal interference nearby, please be away from interference sources or modify
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frequency and channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable.
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The extension line and feeder quality are poor or too long, so the bit error rate is high;
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7 Production guidance

7.1 Reflow soldering temperature
Profile Feature
Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Peak temperature（Tp）
Aveage ramp-down rate（Tp to Tsmax）
Time 25℃ to peak temperature
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Curve characteristics
Solder paste
Min preheating temp.
Mx preheating temp.
Preheating time
Average ramp-up rate
Liquid phase temp.
Time below liquid phase line
Peak temp.
Aveage ramp-down rate
Time to peak temperature for
25℃
E01-2G4M13S User Manual
Sn-Pb Assembly
Sn63/Pb37
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
max 6 minutes
Pb-Free Assembly
Sn96.5/Ag3/Cu0.5
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6℃/second max
max 8 minutes
6