Power integrations TOPSwitch-HX Series Manual page 45

⊕
D S .004 (.10)
-E-
.240 (6.10)
.260 (6.60)
Pin 1
.100 (2.54) (BSC)
.356 (9.05)
-D-
.387 (9.83)
.125 (3.18)
.145 (3.68)
.032 (.81) .048 (1.22)
.037 (.94) .053 (1.35)
www.power.com
SMD-8C (G Package)
.372 (9.45)
.388 (9.86)
⊕
.010 (.25)
E S
Pin 1
.137 (3.48)
MINIMUM
.057 (1.45)
.068 (1.73)
(NOTE 5)
.009 (.23)
.004 (.10)
.012 (.30)
Notes:
.046 .060 .060 .046 1. Controlling dimensions are
2. Dimensions shown do not
.080
.086
.186
3. Pin locations start with Pin 1,
.286 .420
4. Minimum metal to metal
5. Lead width measured at
6. D and E are referenced
Solder Pad Dimensions
.004 (.10)
°
0 -
.036 (0.91)
.044 (1.12)
TOP252-262
inches. Millimeter sizes are
shown in parentheses.
include mold flash or other
protrusions. Mold flash or
protrusions shall not exceed
.006 (.15) on any side.
and continue counter-clock-
wise to Pin 8 when viewed
from the top. Pin 3 is omitted.
spacing at the package body
for the omitted lead location
is .137 inch (3.48 mm).
package body.
datums on the package
body.
°
8
G08C
PI-4015-081716
45
Rev. J 08/16