Table 6- 2 Technical Specifications 6Dl2804-Xmdxx / Xmexx - Siemens 6DL2804 Series Hardware Installation Manual

Distributed i/o device
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Technical specifications
Table 6- 2
Technical specifications 6DL2804-xMDxx / xMExx
6DL2804-
Wall-mounted enclosure
Ex marking
Degree of protection
1)
Dimensions: W x H x D
Material
Weight [kg]
Cover seal
Cable entries for
Voltage (cable-Ø in mm)
Bus (cable-Ø in mm)
Signals (cable-Ø in mm)
3 / 1 row (1Mxxx)
5 / 2 rows (1Mxxx)
Equipotential bonding rail
Bonding terminals
Protective conductor connector
Rated voltage/current
2)
Operating temperature range
6DL2804-1xxxx with installation of
ET200iSP
Permissible humidity
The degree of protection of the enclosure depends on that of the installed parts and the enclosure size.
1)
The actual electrical values depend on the electrical equipment installed. The manufacturer specifies the final values
2)
within the framework of these limits.
The specified permissible operating temperature range is only valid if the enclosure is installed horizontally. A vertical
3)
installation can reduce the maximum permissible temperature (for information on this refer also to the ET200iSP
manual). The max. operating temperature is defined depending on the dissipated heat of the installed components, and
specified on the nameplate.
Note that the operating temperature of the complete setup must be checked again if further components are
subsequently fitted.
30
xMDxx
Type 6DL2804-0xxxx, DMT 02 ATEX E 249 U
650 x 450 x 230
Stainless steel: DIN 1.4404, plate thickness 1.5 mm
35
M32 (18 to 21)
6
12
0.75 to 35 mm² Ex e for equipotential bonding cable, 4 mm² for shield
M6 screw, at least 16 mm²
These values depend on the installed components.
Hardware Installation Manual, 03/2014, A5E00378896F-03
See Ex marking
IP54/IP55
950 x 450 x 230
Silicone rubber
6 M25 (Ex e)
(9 to 12 )
M32 (18 to 21)
3 x 10 mm Cu
connection
-20° C to +xx °C
3)
Max. 95%
Distributed I/O device 6DL2804-xxxxx
xMExx
39
9
18

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