Chipset Features Setup - WinSystems EBC-LP Operation Manual

Small, high-performance, embeddable computer system on a single board
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Auto Con figu ra tion
DRAM Tim ing
LEAD Off Tim ing
DRAM Read Burst
DRAM Write Burst Tim ing
FAST EDO lead off
Re fresh RAS# As ser tion
Fast RAS to CAS De lay
DRAM Page Idle Timer
DRAM En hanced Pag ing
Fast MA to RAS# De lay
SDRAM (CAS Lat/RAS- to- CAS) : 3/3
Sys tem BIOS Cache able
Video BIOS Cache able
8 Bit I/O Reovery Time
16 Bit I/O Re cov ery Time
Memory HoleAt 15M-16M
PCI 2.1 Compliance
3.6
Chipset Fea tures Setup
The op tions in this sec tion con trol the chipset pro gram ming at boot time. In most cases, the de fault
set tings should be used un less you have a clear un der stand ing of the sig nifi cance of the change. It is
pos si ble us ing these op tions to cre ate a sys tem that will ei ther not boot or is very un sta ble or un re li able.
If this should oc cur, there are two meth ods to re turn the sys tem to a sta ble con figu ra tion. If the sys tem
works well enough to get into Setup, sim ply choose the "Load BIOS De faults" op tion and then se lect
"Save and Exit Setup" to re store fac tory de faults. If the sys tem will not run well enough to run Setup, it
will be nec es sary to re move the bat tery source tem po rar ily un til the CMOS mem ory de cays. Ref er to
Sec tion 2.19 for de tails on re ini tial iz ing the CMOS RAM.
Each of the op tions for the Chipset Fea tures Menu will be briefly dis cussed in the sections that
fol low.
030530
WinSystems - "The Embedded Authority"
ROM PCI/ISA BIOS (2A59IA2N)

CHIPSET FEATURES SETUP

Award SOFTWARE, INC.
: En abled
CPU Warning Temperature : Disabled
: 70ns
Current CPU Temperature
: 10/6/4
Shutdown Temperature
: x333/x444
: x333
: Dis abled
: 5 Clks
: 3
: 2 Clks
: En abled
: 2 Clks
: Dis abled
: Dis abled
: 1
ESC : Quit
: 2
F1
: Disabled
F5
: Disabled
F6
F7
EBC-LP OPERATIONS MANUAL
↑ ↓ → ←
: Help
PU/PD/+/- : Modify
: Old Value
Shift) F2 : Color
: Load BIOS Defaults
: Load Setup Defaults
: 4°C/39°F
: 60°C/140°C
: Select Item
Page 3-11

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