HP 24 Disassembly Instructions Manual page 2

Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 Screwdiver
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Removed Rear Cover
2. Removed LCD Bezel
3. Removed Stand base
4. Removed Hinge
5. Removed Converter board & others
6. Removed ODD module
7. Removed HDD module
8. Remove MB Shielding
9. Removed Thermal module
10. Removed Fan module
11. Removed MB
12. Removed Speaker module
13. Removed Camera module
14. Removed LCD panel
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Removed Rear Cover
EL-MF877-00
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Tool Size (if
applicable)
TORX T8
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