1.2
Specifications
1.2.1
Ethernet
Two 10 Gigabit Ethernet channels on the front panel
SFP+ connectors on the front panel - compatible with Finisar FTLX8571D3BCL
SFP+ transceiver module.
One Intel® 82599ES Ethernet controller
Supports PCI Express 2.0 (5 GT/s)
Supports Intel® Virtualization Technology for Connectivity (VT-c) including Vir-
tual Machine Device Queues
(VMDc), which is based on the PCI SIG compliant Single Root I/O Virtualization
(SR-IOV)
Integrated IPSec & LinkSec security engines
Implements TCP segmentation offload (TSO), Receive Side Coalescing (RSC),
iSCSI and Fiber Channel over Ethernet (FCoE) offload
Two LEDs per channel signal both LAN link and activity status
1.2.2
PCI Express
PCIe x8 interface at 5 Gb/s per lane
Both lanes on XMC Connector P15
1.2.3
Power Consumption
+3.3 V, 0.25 A max.
VPWR (+5 V), 1.5 A max.
1.2.4
Mechanical and Environmental Specifications
Operating temperature: 0 ~ 55° C (32 ~ 131° F)
Storage Temperature: -40 ~ 80° C (-40 ~ 176° F)
Humidity (operating): 95% @ 40° C (non-condensing)
Humidity (non-operating): 95% @ 60° C (non-condensing)
Board size: 74 x 149 mm (2.9" x 5.78")
Weight: 0.104 kg (0.23 lb)
1.2.5
Software Support
Drivers from Intel
1.2.6
Compliance
IEEE Std 1386.1-2001 PMC specification
VITA 42.0-2005, 42.3-2006 XMC specifications
2
(VMDq) and Virtual Machine Direct Connect
®
®
for Windows
and Linux
3
MIC-3666 User Manual