Service Precautions; Notes On Soldering; Notes On Replacing; Service Notice - Pioneer XDJ-RX Service Manual

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1. SERVICE PRECAUTIONS

1.1 NOTES ON SOLDERING

• For environmental protection, lead-free solder is used on the printed circuit boards mounted in this unit.
Be sure to use lead-free solder and a soldering iron that can meet specifications for use with lead-free solders for repairs
accompanied by reworking of soldering.
• Compared with conventional eutectic solders, lead-free solders have higher melting points, by approximately 40 ºC.
Therefore, for lead-free soldering, the tip temperature of a soldering iron must be set to around 373 ºC in general, although
the temperature depends on the heat capacity of the PC board on which reworking is required and the weight of the tip of
the soldering iron.
Do NOT use a soldering iron whose tip temperature cannot be controlled.
Compared with eutectic solders, lead-free solders have higher bond strengths but slower wetting times and higher melting
temperatures (hard to melt/easy to harden).
The following lead-free solders are available as service parts:
• Parts numbers of lead-free solder:
GYP1006 1.0 in dia.
GYP1007 0.6 in dia.
GYP1008 0.3 in dia.

1.2 NOTES ON REPLACING

The part listed below is difficult to replace as a discrete component part.
When the part listed in the table is defective, replace whole Assy.
Assy Name
Ref No.
IC102, IC105
MAIN Assy
IC401, IC402
IC602
IC1001
IC1201, IC1301
IC1401
IC1801
USBP1 Assy/ IC8101, IC8301
USBP2 Assy
IC8102, IC8302
EXTB Assy IC8601
IC8701

1.3 SERVICE NOTICE

About the Flash ROM (IC1501) in the MAIN Assy
Replacement of the Flash ROM (IC1501: DYW1864 (first release)) in the MAIN Assy is not possible during service, because
writing of the MAC address on the production line is required.
Therefore, the Flash ROM (IC1501) is not supplied as a service part. If the Flash ROM is defective, replace the whole MAIN Assy.
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Parts that is Difficult to Replace
Part No.
BD9328EFJ DC-DC CONVERTER (for system power)
BD9851EFV DC-DC CONVERTER (for audio power)
MMPF0100F0AEP PO SUPPLY IC (Power management IC)
MCIMX6U6AVM08AC U-PRO IC (Application processor)
K4B1G1646G-BCK0 RAM IC (DDR3)
LAN8720A-CP INTERFACE IC (LAN PHY)
USB2512B-AEZG-TR INTERFACE IC (USB HUB)
BD9328EFJ DC-DC CONVERTER (for USB power supply)
TPS2557DRB High-side SW IC (for USB current control)
R1290K103A DC/DC CONV IC (for display power)
BD81A04EFV-M DRIVER IC (for LCD back right)
XDJ-RX
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Function
IC with heat-pad
IC with heat-pad
QFN IC with heat-pad
BGA
BGA
QFN IC with heat-pad
QFN IC with heat-pad
IC with heat-pad
IC with heat-pad
QFN IC with heat-pad
IC with heat-pad
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A
B
C
D
Remarks
E
F
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