DIPIPM+ Series APPLICATION NOTE
PSSxxMC1Fx, PSSxxNC1Fx
CHAPTER 1 : INTRODUCTION ............................................................................................................................... 2
1.1 Feature of DIPIPM+ ..................................................................................................................................................................................... 2
1.2 Functions ..................................................................................................................................................................................................... 3
1.3 Applications ................................................................................................................................................................................................. 3
1.4 Line-up ........................................................................................................................................................................................................ 4
2.1 Specification of DIPIPM+ ............................................................................................................................................................................. 5
2.1.1 Maximum ratings ........................................................................................................................................................................................................................... 5
2.1.2 Thermal Resistance ...................................................................................................................................................................................................................... 8
2.2.1 Short circuit protection.................................................................................................................................................................................................................14
2.2.2 Control Supply UV Protection .....................................................................................................................................................................................................16
2.3 Package outline of DIPIPM+ ...................................................................................................................................................................... 21
2.3.1 Package outline ...........................................................................................................................................................................................................................21
2.3.2 Marking ........................................................................................................................................................................................................................................22
2.3.3 Terminal Description ...................................................................................................................................................................................................................23
2.4 Mounting Method ....................................................................................................................................................................................... 26
2.4.1 Electric Spacing of DIPIPM+ .......................................................................................................................................................................................................26
2.4.2 Mounting Method and Precautions .............................................................................................................................................................................................26
2.4.3 Soldering Conditions ...................................................................................................................................................................................................................28
3.1 Application guidance ................................................................................................................................................................................. 29
3.1.1 System connection ......................................................................................................................................................................................................................29
3.1.6 Snubber circuit ............................................................................................................................................................................................................................35
3.1.8 SOA of DIPIPM+ at switching state ............................................................................................................................................................................................38
3.1.9 SCSOA ........................................................................................................................................................................................................................................39
3.1.10 Power Life Cycles ......................................................................................................................................................................................................................40
3.2.1 Power loss calculation .................................................................................................................................................................................................................41
3.3 Noise and ESD withstand capability........................................................................................................................................................... 45
3.3.2 Countermeasures and precautions .............................................................................................................................................................................................46
3.3.3 Static electricity withstand capability ...........................................................................................................................................................................................47
4.1 Bootstrap Circuit Operation ........................................................................................................................................................................ 48
CHAPTER 5 : PACKAGE HANDLING .................................................................................................................. 53
5.1 Packaging Specification ............................................................................................................................................................................. 53
5.2 Handling Precautions................................................................................................................................................................................. 54
Table of contents
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OT
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