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Philips Semiconductors
17. Soldering
17.1 Introduction to soldering through-hole mount packages
17.2 Soldering by dipping or by solder wave
17.3 Manual soldering
17.4 Package related soldering information
9397 750 06865
Product specification
This text gives a brief insight to wave, dip and manual soldering. A more in-depth
account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC
packages on a printed-circuit board.
The maximum permissible temperature of the solder is 260 C; solder at this
temperature must not be in contact with the joints for more than 5 seconds. The total
contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (T
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400 C, contact may be up to 5 seconds.
Table 10: Suitability of through-hole mount IC packages for dipping and wave soldering
methods
Package
DBS, DIP, HDIP, SDIP, SIL
[1]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
Rev. 02 — 7 April 2000
6 W mono Bridge Tied Load (BTL) audio amplifier
Soldering method
Dipping
suitable
TDA8943SF
).
stg(max)
Wave
[1]
suitable
© Philips Electronics N.V. 2000. All rights reserved.
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