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Philips Semiconductors
IC card interface
SYMBOL
PARAMETER
V
LOW-level output voltage on
OL(OFF)
pin OFF
I
LOW-level output current on
OL(ALARM)
pin ALARM
V
HIGH-level output voltage
OH(ALARM)
on pin ALARM
t
ALARM pulse width
W
Clock output (CLKOUT; powered from V
f
frequency on CLKOUT
CLKOUT
V
LOW-level output voltage
OL
V
HIGH-level output voltage
OH
t
, t
rise and fall times
r
f
duty factor
Internal oscillator
f
frequency of internal
int
oscillator
Card reset output (RST)
V
output voltage
O(inact)
t
delay between RSTIN and
d(RST)
RST
V
LOW-level output voltage
OL
V
HIGH-level output voltage
OH
t
, t
rise and fall times
r
f
Card clock output (CLK)
V
output voltage
O(inact)
V
LOW-level output voltage
OL
V
HIGH-level output voltage
OH
t
, t
rise and fall times
r
f
duty factor
SR
slew rate (rise and fall)
Strobe input (STROBE)
f
frequency on STROBE
STROBE
V
LOW-level input voltage
IL
V
HIGH-level input voltage
IH
Logic inputs (CLKSEL, CLKDIV1, CLKDIV2, MODE, CMDVCC and RSTIN); note 5
V
LOW-level input voltage
IL
V
HIGH-level input voltage
IH
1999 Oct 12
CONDITIONS
I
= 2 mA
OL(OFF)
V
= 0 V
OL(ALARM)
I
= 2 mA
OH(ALARM)
)
DD
low power
I
= 1 mA
OL
I
= 1 mA
OH
C
= 15 pF; notes 3 and 4
L
C
= 15 pF; notes 3 and 4
L
active mode
sleep mode
inactive modes
RST enabled
I
= 200 A
OL
I
= 200 A
OH
C
= 30 pF
L
inactive modes
I
= 200 A
OL
I
= 50 A
OH
C
= 30 pF; note 3
L
C
= 30 pF; note 3
L
19
Product specification
TDA8002C
MIN.
TYP.
0.4
5
V
1
DD
6
20
0
20
16
0
0.5
V
0.5
DD
8
40
60
2
2.5
3
32
0
0.3
100
0
0.3
V
0.5
V
CC
0.5
0
0.3
0
0.3
V
0.5
V
CC
8
45
55
0.2
0
10
0
0.3V
0.7V
V
DD
0
0.3V
0.7V
V
DD
MAX.
UNIT
V
A
V
ms
MHz
kHz
V
V
ns
%
MHz
kHz
V
ns
V
V
CC
ns
V
V
V
CC
ns
%
V/ns
MHz
V
DD
V
DD
V
DD
V
DD
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