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Philips Semiconductors
IC card interface
CHARACTERISTICS
V
= 3.3 V; T
= 25 C; f
DD
amb
SYMBOL
PARAMETER
Supplies
V
supply voltage
DD
I
supply current
DD(lp)
I
supply current
DD(idle)
I
supply current
DD(active)
V
threshold voltage on V
th2
voltage supervisor
V
hysteresis on V
hys2
Card supply
V
output voltage
CC(O)
I
output current
CC(O)
SR
slew rate
Crystal connections (XTAL1 and XTAL2)
C
external capacitors
ext
f
resonance frequency
xtal
1999 Oct 12
= 10 MHz; unless otherwise specified.
xtal
low-power mode
Idle mode; f
active mode; V
f
CLKOUT
f
CLK
f
CLK
f
CLK
active mode; V
f
CLKOUT
f
CLK
f
CLK
f
CLK
for
falling
DD
th2
Idle mode
active mode
V
CC
DC load
I
= 40 nAs; AC load
CC
V
CC
DC load
I
= 24 nAs; AC load
CC
V
CC(O)
V
short-circuited to ground
CC
rising or falling slope
note 1
note 2
CONDITIONS
= 10 MHz
CLKOUT
= 5 V;
CC(O)
= 10 MHz
= LOW; I
= 100 A
CC
= 5 MHz; I
= 10 mA
CC
= 5 MHz; I
= 55 mA
CC
= 3 V;
CC(O)
= 10 MHz
= LOW; I
= 100 A
CC
= 5 MHz; I
= 10 mA
CC
= 5 MHz; I
= 55 mA
CC
= 5 V; I
< 55 mA;
CC
= 3 V; I
< 55 mA;
CC
= from 0 to 5 or 3 V
17
Product specification
TDA8002C
MIN.
TYP.
3
6.5
150
5
8
50
140
8
50
140
2.2
2.4
50
100
150
0.3
4.6
5.4
4.6
5.4
2.76
3.24
2.76
3.24
55
200
0.10
0.15
0.20
15
2
24
MAX.
UNIT
V
A
mA
mA
mA
mA
mA
mA
mA
V
mV
V
V
V
V
V
mA
mA
V/ s
pF
MHz
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