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Philips Semiconductors
IC card interface
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); note 1.
SYMBOL
V
digital supply voltage
DDD
V
analog supply voltage
DDA
V
card supply voltage pins;
CC
XTAL1, XTAL2, ALARM, CS, MODE,
RSTIN, CLKSEL, AUX2UC, AUX1UC,
CLKDIV1, CLKDIV2, CLKOUT,
STROBE, CMDVCC, CV/TV and OFF
V
input voltage on card contact pins;
i(card)
I/O, AUX2, PRES, PRES, AUX1, CLK,
RST and V
V
electrostatic handling voltage
es
on pins I/O, AUX2, PRES, PRES,
AUX1, CLK, RST and V
on all other pins
T
storage temperature
stg
P
continuous total power dissipation
tot
TDA8002CT/x
TDA8002CG
T
ambient temperature
amb
T
junction temperature
j
Note
1. Stress beyond these levels may cause permanent damage to the device. This is a stress rating only and functional
operation of the device under this condition is not implied.
HANDLING
Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.
Method 3015 (HBM 1500 , 100 pF) 3 positive pulses and 3 negative pulses on each pin with respect to ground.
THERMAL CHARACTERISTICS
SYMBOL
R
thermal resistance from junction to ambient
th(j-a)
SOT136-1
SOT401-1
1999 Oct 12
PARAMETER
CC
CC
PARAMETER
CONDITIONS
T
= 25 to +85 C
amb
T
= 25 to +85 C
amb
CONDITIONS
in free air
16
Product specification
TDA8002C
MIN.
MAX.
0.3
+6.5
V
0.3
+6.5
V
0.3
+6.5
V
0.3
+6.5
V
6
+6
kV
2
+2
kV
55
+125
C
0.56
W
0.46
W
25
+85
C
150
C
VALUE
UNIT
70
K/W
91
K/W
UNIT
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