Nokia NSE–3 SERIES Service Manual page 19

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PAMS
Technical Documentation
Pin
Name
Min
8
XMIC
2.0
1.47
2.5
100
HMIC
0
9
SGND
10
XEAR
16
4.7
16
HEAR
11
MBUS
0
2.0
12
FBUS_RX
0
2.0
13
FBUS_TX
0
2.0
14
GND
0
Original 11/97
Typ
Max
Unit
2.2
kΩ
1
Vpp
1.55
2.85
µA
600
58
490
mV
3.2
29.3
mV
47
µF
10
380
47
µF
10
300
10
kΩ
1.0
Vpp
22
626
mV
10
kΩ
1500
2.8
28
626
mV
logic low
0.8
logic high
2.85
logic low
0.8
logic high
2.85
logic low
0.5
logic high
2.85
0.3
Notes
Input AC impedance
Maximum signal level
V
Mute (output DC level)
V
Unmute (output DC level)
Bias current
Maximum signal level
Microphone signal
Connected to COBBA MIC3P input
Output AC impedance (ref. GND)
Series output capacitance
Resistance to phone ground
Output AC impedance (ref. GND)
Series output capacitance
Load AC impedance to SGND (Head-
set)
Load AC impedance to SGND (Acces-
sory)
Maximum output level (no load)
Output signal level
Load DC resistance to SGND (Acces-
sory)
Load DC resistance to SGND (Head-
set)
V
DC voltage (47k pull–up to VBB)
Earphone signal (HF– HFCM)
Connected to COBBA HF output
V
Serial bidirectional control bus.
Baud rate 9600 Bit/s
Phone has a 4k7 pullup resistor
V
Fbus receive. Serial Data
Baud rate 9.6k–230.4kBit/s
Phone has a 220k pulldown resistor
V
Fbus transmit. Serial Data
Baud rate 9.6k–230.4kBit/s
Phone has a 47k pullup resistor
V
Supply ground
NSE–3
System Module
Page 3 – 13

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