<Sub board (for KD-S27J)>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
MARK
UL
R937
R938
C937
No.MA465
C934
T2A
R932
R936
C936
(No.MA465<Rev.003>)33/37
PbF
R931
R933
created date:2010-08-05