HP Pavilion G6 Maintenance And Service Manual page 85

9. Remove the heat sink assembly (4) by lifting straight up.
Each time the heat sink assembly is removed, the thermal material must be thoroughly cleaned from
the system board at locations (1) and (2), from the heat sink assembly at locations (4) and (5), and
from the processor (3). Thermal pads and thermal paste must be installed on all surfaces before the
heat sink assembly is reinstalled.
NOTE: Thermal pads and thermal paste are included with all heat sink assembly, system board,
and processor spare part kits.
The following illustration shows the locations for thermal material on systems with Intel processors.
Each time the heat sink assembly is removed, the thermal material must be thoroughly cleaned from
the system board at locations (1), (2), and (3), from the heat sink assembly at locations (5), (6), and
(7), and from the processor (4). Thermal pads and thermal paste must be installed on all surfaces
before the heat sink assembly is reinstalled.
Component replacement procedures 77
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