Sony BDP-CX7000ES Service Manual page 39

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3 7 6 3 1 5 1 5 0
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
• : Internal component.
f
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen
(Conductor Side) from the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Caution:
Pattern face side: Parts on the pattern face side seen
(SIDE B) from the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(SIDE A) the parts face are indicated.
• ET-001, MB-124-MEGA-EJ and VP-062EJ boards are
multi-layer printed board. However, the patterns of inter-
mediate-layers have not been included in this diagrams.
• Indication of transistor.
C
Q These are omitted.
B E
• Lead layouts
T E
L 1 3 9 4 2 2 9 6 5 1 3
Lead layout of conventional IC CSP (Chip Size Package)
w w w
BDP-CX7000ES
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• : Internal component.
f
• C : Panel designation.
Note: Note:
The components identi- Les composants identifi és
fi ed by mark 0 or dotted par une marque 0 sont
line with mark 0 are criti- critiques pour la sécurité.
cal for safety. Ne les remplacer que par
Replace only with part une pièce portant le nu-
number specifi ed. méro spécifi é.
• A : B+ Line.
• B : B– Line.
• H : Adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : BD PLAY
: Impossible to measure
*
• Voltages are taken with VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
surface
• Signal path.
: AUDIO
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: VIDEO
E
: BD/DVD
J
: USB
L
: LAN
d
• The voltage and waveform of CSP (chip size package)
cannot be measured, becaise its lead layout is different
from that of conventional IC.
x a o
y
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• Circuit Boards Location.
MB-124-MEGA-EJ board
IMD (ES) board
PSWES board
FLDES board
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3 7 6 3
SDT board
u 1 6 3
.
39 39
2 4
9 9 8
VP-062EJ board
USB (ES) board
FRTES board
FRBES board
JOGES board
PWRDR (ES) board
SLD board
1 5 1 SLK board 5 0 8 9 2 4
DR-510 board
LED board
SDR board
DRV board
STB board
MDO board
SDO board
m
c o
BDP-CX7000ES
2
9 9
ET-001 board
AUES board
RSES board
switching regulator
BRIDGE-ES board
9 8 2 9 9
MLD board