Board Level 2.5 Repairs - HTC Neon Service Manual

Table of Contents

Doc. Title

9.2

Board Level 2.5 Repairs

Basic Repair Instructions for Component Replacement:

Step 1

Place the solder-proof tape to cover the surrounding area of the components which being replaced.

Warning：DO NOT overheat the tape and components to avoid the tape melted and the components damaged

Step 2

Use Heater Gun (HAKO850B, set the temperature between 350°C, Air Speed 3~5) to remove the

components.

Step 3

Wait till the temperature cool down before removing the solder-proof tape to avoid other components

being removed

Step 4

After the damaged or defective components have been replaced; clear the surroundings for solder

and flux residues.

Notice:

All the parts of the PCB should be checked if it is missing or not.

The OP must to wear antistatic wrist band. Don't put boards together and avoid hitting them.

When you solder and repair that the soldering iron ,temperature must be setup 415 .

temperature range is 415 ±5 ),and the solder wire's diameter is 0.4/0.5/0.6mm

HTC CONFIDENTIAL

HTC Corporation

Neon Service Manual

℃

Doc. No.

DOC- 00036367

Issued Date

1/12/2007

Revised Date

11/19/2008

Page

78 of 88

(SAC 305 (1.1%)

SM-TP002-0706

REV.

A06

℃ (The

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