Intel BX80605X3440 - Quad Core Xeon X3440 Reference page 38

Section 6.2. To ensure maximum flexibility for future processors, systems should be
designed to the Thermal Solution Capability guidelines, even if a processor with lower
power dissipation is currently planned.
®
Table 6-1. Intel Xeon
Product
® ®
Intel Xeon
processor 3400
series (95W)
® ®
Intel Xeon
processor 3400
series (45W)
Notes:
1. The package C-state power is the worst case power in the system configured as follows:
- Memory configured for DDR3 1333 and populated with 2 DIMM per channel.
- DMI and PCIe links are at L1.
2. Specification at DTS = -50 and minimum voltage loadline.
3. Specification at DTS = -50 and minimum voltage loadline.
4. Specification at DTS = -64 and minimum voltage loadline.
5. These DTS values (in Notes 2-4) are based on the TCC Activation MSR having a value of 100, see
Section
6. These values are specified at V
Systems must be designed to ensure the processor is not to be subjected to any static V
combination wherein V
the EDS.
7. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at DTS = -1.
TDP is achieved with the Memory configured for DDR3 1333 and 2 DIMMs per channel.
8. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements. The FMB 2009B (09B) is equivalent to the thermal requirements for the Intel®
Core™ 2 Quad Q9000 processor series. The FMB 2009A (09A ) is equivalent to the thermal requirements for
the Intel® Core™ 2 Duo E8000 processor series. Reuse of those thermal solutions is recommended with
the updated mechanical attach to straddle the LGA1156 socket.
9. Not 100% tested. Specified by design characterization.
38
Specifications and Design Guidelines
®
Processor 3400 Series Thermal Specifications
Max
Power
FMB 8 Package
C1E
1,2,5,9
(W)
2009B 28
(09B)
2009A 21
(09A)
6.2.1.
CC_MAX
exceeds V
CCP CCP_MAX
Max Max
Power Power
Package Package
C3 C6
1,3,5,9 1,4,5,9
(W) (W)
22 5.5
17 4.0
and V for all other voltage rails for all processor frequencies.
NOM
at specified I . Please refer to the loadline specifications in
CCP
Document Number: 424077 Revision: 2.0Thermal/Mechanical
Thermal Specifications
TTV
Maximum
Thermal
Min T
CASE
Design
(°C) TCASE
Power
(°C)
6,7
(W)
95 5 Figure 6-1
& Table 6-2
45 Figure 6-2
& Table 6-3
and I
CC CC
TTV