Table Of Contents - Intel BX80605X3440 - Quad Core Xeon X3440 Reference

Contents
1 Introduction .............................................................................................................. 7
1.1 References ......................................................................................................... 7
1.2 Definition of Terms .............................................................................................. 8
2 Package Mechanical and Storage Specifications....................................................... 11
2.1 Package Mechanical Specifications ....................................................................... 11
2.2 Processor Storage Specifications ......................................................................... 16
3 LGA1156 Socket ...................................................................................................... 17
3.1 Board Layout .................................................................................................... 19
3.2 LGA1156 Socket NCTF Solder Joints..................................................................... 20
3.3 Attachment to Motherboard ................................................................................ 21
3.4 Socket Components........................................................................................... 21
3.5 Package Installation / Removal ........................................................................... 23
3.6 Durability ......................................................................................................... 24
3.7 Markings .......................................................................................................... 25
3.8 Component Insertion Forces ............................................................................... 25
3.9 Socket Size ...................................................................................................... 25
4 Independent Loading Mechanism (ILM)................................................................... 27
4.1 Design Concept................................................................................................. 27
4.2 Assembly of ILM to a Motherboard....................................................................... 30
4.3 ILM Interchangeability ....................................................................................... 31
4.4 Markings .......................................................................................................... 32
5 LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications . 33
5.1 Component Mass............................................................................................... 33
5.2 Package/Socket Stackup Height .......................................................................... 33
5.3 Socket Maximum Temperature ............................................................................ 33
5.4 Loading Specifications........................................................................................ 34
5.5 Electrical Requirements ...................................................................................... 35
5.6 Environmental Requirements .............................................................................. 36
6 Thermal Specifications ............................................................................................ 37
6.1 Thermal Specifications ....................................................................................... 37
6.2 Processor Thermal Features ................................................................................ 44
6.3 Platform Environment Control Interface (PECI) ...................................................... 48
7 Sensor Based Thermal Specification Design Guidance.............................................. 51
7.1 Sensor Based Specification Overview ................................................................... 51
7.2 Sensor Based Thermal Specification ..................................................................... 52
7.3 Thermal Solution Design Process ......................................................................... 54
7.4 Fan Speed Control (FSC) design process............................................................... 56
7.5 System Validation ............................................................................................. 58
8 1U Collaboration Thermal Solution .......................................................................... 59
8.1 Performance Targets.......................................................................................... 59
8.2 Thermal Solution............................................................................................... 62
8.3 Assembly ......................................................................................................... 63
8.4 Geometric Envelope for 1U Thermal Mechanical Design .......................................... 64
8.5 Thermal Interface Material.................................................................................. 64
9 Thermal Solution Quality and Reliability Requirements............................................ 65
9.1 Collaboration Heatsink Thermal Verification .......................................................... 65
9.2 Mechanical Environmental Testing ....................................................................... 65
Thermal/Mechanical Specifications and Design Guidelines 3