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®
Intel
Server Board S5000PAL / S5000XAL TPS
8.
Power and Environmental Specifications
8.1
Intel® Server Board S5000PAL / S5000XAL Design
Specifications
Operation of the server board at conditions beyond those shown in the following table may cause
permanent damage to the system. Exposure to absolute maximum rating conditions for extended periods
may affect system reliability.
Operating Temperature
Non-Operating Temperature
DC Voltage
Shock (Unpackaged)
Shock (Packaged)
Vibration (Unpackaged)
Note:
1
Chassis design must provide proper airflow to avoid exceeding the Dual-Core Intel
processor 5000 sequence maximum case temperature.
Disclaimer Note: Intel Corporation server boards support add-in peripherals and contain a number of
high-density VLSI and power delivery components that need adequate airflow to cool. Intel ensures
through its own chassis development and testing that when Intel server building blocks are used together,
the fully integrated system will meet the intended thermal requirements of these components. It is the
responsibility of the system integrator who chooses not to use Intel developed server building blocks to
consult vendor datasheets and operating parameters to determine the amount of air flow required for their
specific application and environmental conditions. Intel Corporation cannot be held responsible, if
components fail or the server board does not operate correctly when used outside any of their published
operating or non-operating limits.
Revision 1.9
Table 33: Server Board Design Specifications
≥ 20 to < 40
≥ 40 to < 80
≥ 80 to < 100
≥100 to < 120
Intel order number: D31979-010
Power and Environmental Specifications
0º C to 55º C
-40º C to 70º C (-40º F to 158º F)
± 5% of all nominal voltages
Trapezoidal, 50 g, 170 inches/sec
< 20 lbs
36 inches
30 inches
24 inches
18 inches
12 inches
≥120
9 inches
5 Hz to 500 Hz 3.13 g RMS random
1
(32º F to 131º F)
®
Xeon
®
69
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