Reliability; Thermal Considerations For Components - Intel BLKD101GGCL Specification

Intel Desktop Board D101GGC Technical Product Specification
Table 31 provides maximum case temperatures for the components that are sensitive to thermal
changes. The operating temperature, current load, or operating frequency could affect case
temperatures. Maximum case temperatures are important when considering proper airflow to cool
the board.
Table 31.

Thermal Considerations for Components

Component
Intel Pentium 4 processor
ATI Radeon Xpress 200 Northbridge
IXP 450 Southbridge
For information about
Intel Pentium 4 processor datasheets and specification updates

2.12 Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the D101GGC board is
95,006 hours.
52
Maximum Case Temperature
For processor case temperature, see processor datasheets and
processor specification updates
o
95 C
o
85 C
Refer to
Section 1.2, page 14