Figure 7-33. Filling Groove With Adhesive; Figure 7-34. Application Of Accelerant - Intel E2180 - Pentium Dual-Core 2.00GHz 800MHz 1MB Socket 775 CPU Design Manuallines

Thermal and mechanical design guidelines
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36. Clean the surface of the IHS with Alcohol and use compressed air to remove any
remaining contaminants.
37. Fill the rest of the groove with Loctite* 498 Adhesive. Verify under the microscope
that the thermocouple wire is below the surface along the entire length of the IHS
groove (see Figure 7-33).

Figure 7-33. Filling Groove with Adhesive

38. To speed up the curing process apply Loctite* Accelerator on top of the Adhesive
and let it set for a couple of minutes (see Figure 7-34).

Figure 7-34. Application of Accelerant

106
Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines

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