Package Marking; Processor Top-Side Marking - Intel P9500 - Core 2 Duo 2.53 GHz 6M L2 Cache 1066MHz FSB Socket P Mobile Processor Manual

Table 4-3. Processor Package Load Limits at Power Tab (Sheet 2 of 2)
Parameter
Tx
T+y
T-y
Notes:
1. Load determination done with 100-lb. load on the processor heatsink.
4.2

Package Marking

The following section details the processor top-side and bottom-side markings for
engineering samples and production units. This is provided to aid in identification.
Specific details regarding individual fields in the product markings will be furnished in a
future release of this document.
4.2.1

Processor Top-Side Marking

The top-side mark is a laser marking on the IHS.
of the processor top-side mark that provides the following information:
• Intel
• Itanium
• Assembly Process Order (APO) Number
• Unit Serial Number
• 2D Matrix Mark
72
Description
Allowable torque at the package power
tab in X axis
Allowable torque at the package power
tab in +y direction
Allowable torque at the package power
tab in -y direction
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Processor Family Legal Mark
Dual-Core Intel
Mechanical Specifications
1
Value Comments
0.57Nm max
1.24 Nm max Torque on the package edge in +Y
direction is determined by the load
applied in -Z and the distance from the
edge the package to the socket.
Torque on the package edge in -Y
direction is determined by the load
applied in +Z and the distance from
the edge the package to the heatsink
0.93Nm base.
max
To determine T+y, distance from the
edge the package to the socket of
55.7mm is applied
To determine T-y, distance from the
edge the package to the heatsink
pedestal of 42mm is applied
Figure 4-7 shows the general location
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Itanium Processor 9000 and 9100 Series Datasheet