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®
®
Intel
Pentium
III Processor in the FC-PGA2 Package Thermal Design Guidelines
1.3.
Definition of Terms
T
LA
temperature should be measured just "upstream" of a passive heatsink, or at the fan inlet for an
active heatsink. (See Section 7.3: Local-ambient Temperature Measurement Guidelines)
T
AMBIENT-OEM
defined by the system designer (OEM).
T
AMBIENT-EXTERNAL
T
AMBIENT-MAX
system in maximum external temperature conditions and measuring the ambient temperature locally
surrounding the processor. Under these conditions, T
T
CASE-MAX
datasheet.
T
CASE
TIM - Thermal Interface Material. The thermally conductive compound between the heatsink and
the processor case. This material fills the air gaps and voids, and enhances the spreading of the heat
from the case to the heatsink.
TIM
thermal resistance).
CA
controlled by the system thermal solution.
P
MAX
PGA370 Socket - a through-hole mount Zero Insertion Force (ZIF) socket designed to accept the
Intel
FC-PGA2 package - the Flip Chip Pin Grid Array processor package with an integrated heat
spreader (IHS).
ACPI - Advanced Configuration and Power Interface (See
Bypass - the area between a passive heatsink or air pass-through and any object that can act to form
a duct. For this example it can be expressed as a dimension away from the outside dimension of the
fins to the nearest surface.
TDP - Thermal Design Power. The processor thermal power specification in the processor
datasheet. OEMs must design their processor thermal solutions to meet the TDP as listed in the
respective datasheets. (Also known as Thermal Design Point.)
Intel
06Bxh, as well as the higher frequencies of Intel
the Pentium
8
- the measured ambient temperature locally surrounding the processor. The ambient
- the target worst-case ambient temperature at a given external system location as
- the measured ambient temperature at the OEM defined external system location.
- the target worst-case local-ambient temperature. It is determined by placing the
- the maximum allowed case temperature of the processor, as specified in the processor
- the measured case temperature of the processor.
- the thermal resistance of the thermal interface material. Also referred to as
- the thermal resistance between the processor's case and the ambient air. This is defined and
- the maximum processor power, as specified in the processor's datasheet.
®
®
III processor in the FC-PGA2 package.
Pentium
®
®
III processor in the FC-PGA2 package - any Pentium
Pentium
®
III Processor for the PGA370 Socket Datasheet for further details).
= T
.
LA
AMBIENT-MAX
http://www.teleport.com/~acpi/
®
III processor with CPUID
®
®
Pentium
III processors with CPUID 068xh (see
R
(case to sink
CS
)
249660-001
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